MEMS (Micro Electro Mechanical System) thermal acoustic particle vibration velocity sensor with sound field enhanced microstructure and method

Abstract

The invention discloses an MEMS thermal acoustic particle vibration velocity sensor of a sound field enhancement microstructure and a method. According to the invention, the on-chip integrated sound field self-enhancement through hole is adopted, the processing of the sound field self-enhancement through hole is completed when the heating temperature measurement cross beam is processed by using the MEMS technology, a macro mechanical processing means is not required to be used for designing a sound field enhanced packaging structure, the packaging size is greatly reduced, and the application range of the sensor is broadened; due to the fact that the heating temperature measuring beam and the sound field self-enhancement through hole are all machined in a unified mode through the MEMS technology, the MEMS technology has extremely high machining precision, and therefore the method avoids the problem that in the traditional sensor assembling process, assembling errors exist between a chipprepared through the MEMS technology and a packaging structure prepared through the machining means; due to the fact that the sensor manufactured through the method is small in size, reflection and scattering of a to-be-measured sound field are small, distortion of the to-be-measured sound field cannot be caused, and single-point accurate measurement is achieved.

Description

technical field [0001] The invention relates to acoustic signal sensor technology, in particular to a MEMS thermal acoustic particle vibration velocity sensor based on an on-chip integrated sound field enhanced microstructure and a method thereof. Background technique [0002] The acoustic signal consists of two parts: the sound pressure and the vibration velocity of the acoustic particles caused by the sound. The sound pressure is a scalar signal, which has nothing to do with the direction; the sound particle vibration velocity is a vector signal, which contains both the intensity information of the sound and the direction information of the sound propagation. Traditional microphones measure sound pressure signals, and a single device can only give the strength of the sound, but cannot measure the vector information of the sound. Localization of sound sources requires the use of specialized vector sensors or sensor arrays. Acoustic vector sensor is a kind of vector measur...

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Problems solved by technology

[0005] (1) Since the sound field enhancement structure adopts macroscopic mechanical processing means, the size of the package structure is large, which limits the scope of application of the sensor;

[0006] (2) The assembly process between the chip prepared by MEMS technology and the packaging structure prepared by mechanical processing is complicated, and assembly errors will seriously affect the measurement accuracy of the sensor;

[0007] (3) Due to the large size of the sensor, the reflection and scattering of the sound field to be measured are inevitable, resulting in distortion of the sound field to be measured, and at the same time, there are errors in the measurement results

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