Quantum dot transfer printing method

A technology of quantum dots and stamps, applied in the field of quantum dots, can solve problems such as incompleteness and defective quantum dot patterns

Active Publication Date: 2019-06-25
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, and provide a quantum dot transfer printing method, which aims to solve the technical problem that the quantum dot patterns obtained by the existing quantum dot transfer are often defective and incomplete

Method used

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preparation example Construction

[0030]Further, the preparation method of the initial embedded body includes: providing a shape-memory polymer, a curing agent and an accelerator; mixing the shape-memory polymer, the curing agent and the accelerator, adding to the In the first mold of the initial embedded body described above, curing treatment is carried out to obtain the initial embedded body shown. The curing agent is selected from methyltetrahydrophthalic anhydride and / or polyoxypropylene diamine, but not limited to these; the accelerator is selected from decylamine and / or 2-ethyl-4-methyl Kiimidazoles, but not limited to these types. In a specific preferred embodiment, the molar ratio of the shape memory polymer, the curing agent and the accelerator is 4:1:2, and the performance of the intercalation body prepared under this molar ratio is the best. In another preferred embodiment, the step of curing includes: firstly heating at 100°C for 1.5h, and then heating at 130°C for 1h, and the curing effect is the...

Embodiment 1

[0039] 1. Preparation of deformable inserts of shape memory polymers:

[0040] Utilize mold preparation such as figure 1 The initial embedding body of structure a: heat epoxy resin EP826 to 70 degrees Celsius and melt, add polyoxypropylene diamine epoxy curing agent and decylamine accelerator and mix, wherein the molar ratio of epoxy resin, curing agent, and decylamine is 4:1:2, shake evenly and pour into the mold, heat at 100 degrees Celsius for 1.5 hours to cure, and then heat at 130 degrees Celsius for 1 hour to post-cure. Separating the shape memory polymer from the mold to obtain an initial shape memory polymer embedded body, the glass transition temperature of which is 50-70 degrees Celsius; placing the shape memory polymer initial embedded body with the side facing down with the surrounding wall facing down. into a flat mold, such as figure 2 As shown, heat to 80 degrees Celsius, and then apply uniform pressure to deform the side with the surrounding wall until the s...

Embodiment 2

[0046] 1. Preparation of deformable inserts of shape memory polymers:

[0047] Utilize mold preparation such as figure 1 The initial embedding body of structure b: heat epoxy resin EP826 to 70 degrees Celsius and melt, add polyoxypropylene diamine epoxy curing agent and decylamine accelerator and mix, wherein the molar ratio of epoxy resin, curing agent, and decylamine is 4:1:2, shake evenly and pour into the mold, heat at 100 degrees Celsius for 1.5 hours to cure, and then heat at 130 degrees Celsius for 1 hour to post-cure. Separating the shape memory polymer from the mold to obtain an initial shape memory polymer embedded body, the glass transition temperature of which is 50-70 degrees Celsius; placing the shape memory polymer initial embedded body with the side facing down with the surrounding wall facing down. into a flat mold, such as figure 2 As shown, heat to 80 degrees Celsius, and then apply uniform pressure to deform the side with the surrounding wall until the s...

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Abstract

The invention belongs to the technical field of quantum dots, and particularly relates to a quantum dot transfer printing method. The quantum dot transfer printing method comprises the following stepsthat a seal is provided, a deformation embedded body is arranged on a seal surface protruding part of the seal, and the deformation embedded body is obtained in the mode that an initial embedded bodymanufactured by materials containing shape memory polymers are deformed; a quantum dot initial film arranged on the surface of a donor substrate is provided, and the initial film is subjected to transfer printing onto the seal surface, provided with the deformation embedded body, of the seal to form a quantum dot patterned film layer; the seal with the quantum dot pattern film layer subjected totransfer printing makes contact with a target substrate, the deformation embedded body is restored to the initial embedded body, and thus the quantum dot pattern film layer is subjected to transfer printing onto the target substrate. According to the quantum dot transfer printing method, part of pattern residues finally caused by nonuniform stress restoring is reduced, the integrity of transfer printing of the quantum dot pattern film layer is improved, and externally-applied stress required by repeated using of the seal is reduced.

Description

technical field [0001] The invention belongs to the technical field of quantum dots, and in particular relates to a quantum dot transfer printing method. Background technique [0002] Quantum dots have many advantages such as easy adjustment of luminescent color, high color saturation, solution processing, and high stability. Therefore, quantum dot luminescence is regarded as a strong competitor for the next generation of display technology. In the preparation of quantum dot thin films, the spin coating method is the fastest and convenient solution processing method with good film quality. Quantum dot films. At present, the methods of patterning quantum dots mainly include inkjet printing and transfer printing. [0003] The conventional transfer printing process usually uses a viscoelastic stamp as a transfer carrier and uses kinetic control to achieve transfer. The transfer process specifically includes two steps. The first step is to transfer the quantum dot pattern fro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M1/12
Inventor 张滔向超宇李乐辛征航张东华
Owner TCL CORPORATION
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