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Isostatic Pressing Cylindrical Target Thread Processing Method

A thread processing and isostatic pressing technology, applied in metal material coating process, vacuum evaporation coating, coating, etc., can solve the problems of product quality not meeting user requirements, low work efficiency, poor practicability, etc., and achieve saving on processing Time, cost saving, practical effect

Active Publication Date: 2021-06-08
东莞市欧莱溅射靶材有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing target material processing method has complex procedures, product quality does not meet user requirements, and work efficiency is low, resulting in increased cost and poor practicability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention.

[0027] The present invention includes the following steps: providing the thread and the copper sleeve of the target, the outer circle of the target and the thread surface have a machining allowance of 0.5-2mm; turning the target, turning an end face of the target on a lathe , and finish turning the inner diameter of the target; put the copper sleeve on the oven to heat and bake, and put the copper sleeve on the target, and use isostatic pressing technology to make the copper sleeve and the target tightly matched; Drill pin holes on the target and put pins on it; further turn the target on the lathe, turn the thread on one side of the target, and turn the reference size of the target.

[0028] The target material is one of chromium, titanium or aluminum, which can process a variety of metal targ...

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PUM

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Abstract

The present invention relates to the field of target processing, in particular to a thread processing method for an isostatic cylindrical target. The present invention includes the following steps: providing a target thread and a copper sleeve. ~2mm machining allowance; turn the target material, turn one end face of the target material on the lathe, and finish turning the inner diameter of the target material; put the copper sleeve on the oven to heat and bake, and put the copper sleeve into the On the target, use isostatic pressing technology to make the copper sleeve and the target tightly fit together; drill the pin hole on the target on the drilling machine, and put the pin on it; further turn the target on the lathe Turn the thread on one side of the material, and turn the reference size of the target. The present invention realizes the purposes of simple processing, good product quality and high working efficiency through the above processing method.

Description

technical field [0001] The invention relates to the field of target material processing, in particular to an isostatic pressure cylindrical target material thread processing method. Background technique [0002] Sputtering technology is one of the commonly used processes in the field of semiconductor manufacturing. With the increasing development of sputtering technology, sputtering targets play an increasingly important role in sputtering technology. The quality of sputtering targets directly affects the sputtering technology. Film quality after injection. Targets with strict composition ratio, delicate structure, high purity, high density, and large size are the basic requirements of modern high-end optical and electrical device manufacturing industries, such as displays and solar thin-film batteries. This also puts forward higher requirements for traditional target production technology and equipment. [0003] The existing target material processing method has complex p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00C23C14/34
Inventor 张益
Owner 东莞市欧莱溅射靶材有限公司
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