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Plate, heating plate with same, and preparation process of heating plate

A heating plate and panel technology, applied in the field of panels and decorative panels, can solve problems such as difficult maintenance, increased construction load, and long construction period, and achieve the effects of easy installation and disassembly, reduced laying costs, and convenient and reliable replacement

Pending Publication Date: 2019-06-28
刘文晓
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the complex structure of floor heating, many construction techniques, complicated techniques and long construction period, the construction difficulty is increased.
[0005] 2. Since the filling layer is 5cm thick and the decorative material is 1-1.5cm thick, it seriously affects the heat dissipation speed of the floor heating and increases the building load;
[0006] 3. The floor heating is buried in the lower part of the floor decoration materials. Once a quality problem occurs, all or most of the floor will be removed, resulting in difficult maintenance and high maintenance costs;
[0007] 4. The currently used decorative materials tiles, marble, and wooden floors have no reuse value after removal

Method used

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  • Plate, heating plate with same, and preparation process of heating plate
  • Plate, heating plate with same, and preparation process of heating plate
  • Plate, heating plate with same, and preparation process of heating plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as Figure 1-Figure 3 , Figure 5 As shown, a heating plate described in this embodiment includes a heating layer 3, a docking socket 8, a filling layer 2 and a board 1, and the docking socket 8 is installed on the two mounting frames 7 of the board 1, and the filling layer 2 is filled and positioned at Between the two installation frames 7 of the board 1 , and the heating layer 3 is attached to the lower side of the board by pressing the filling layer 2 , and the heating layer 3 is electrically connected to the docking socket 8 .

[0041] In order to make installation and disassembly easy, when a large-area floor or wall panel is used as a floor or wall panel, after local damage (especially in the middle position), you only need to connect the slot and chuck of one of the heating boards with the other heating board during disassembly. The card slot and the clamp head can be separated rigidly, so that the local maintenance and replacement are convenient and reliab...

Embodiment 2

[0054] In the preparation process of a heating plate described in this embodiment, the heating plate to be prepared adopts the structure of the heating plate in Example 1, and specifically includes the following preparation steps:

[0055] S1. Material selection and plate making, select the metal plate to make the block 6, the slot 5, and the mounting frame 7 of the metal plate through extrusion and cutting processes;

[0056] S2. Cutting, cutting and blanking the formed plate according to the set size to obtain a metal plate;

[0057] S3. Surface treatment, rounding the corners of the metal plate, processing the surface decoration layer on the upper surface and processing and curing the wear-resistant layer on the surface decoration layer;

[0058] The steps of processing the surface decoration layer and processing and curing the wear-resistant layer on the surface decoration layer are as follows:

[0059] S31. After powder coating the surface of the metal plate, use wood gr...

Embodiment 3

[0074] The preparation process of a heating plate described in this embodiment, its general steps are consistent with embodiment 2, but different from embodiment 2 in that:

[0075] The steps of processing the surface decoration layer and processing and curing the wear-resistant layer on the surface decoration layer are as follows:

[0076] S311. Select the decorative layer base material that has been sprayed or electrophoresed;

[0077] S312. Wrap the transferred substrate with wood grain thermal transfer paper, put the front of the wood grain thermal transfer paper opposite to the front of the transferred substrate, and fix the interface of the paper with high temperature resistant adhesive tape to prevent The wood grain heat transfer paper is released;

[0078] S313. Pressurize and heat the flatbed thermal transfer machine, the transfer temperature is 160-180°C, and the time is 18-25 seconds;

[0079] S314. Tear off the heat transfer paper and use PET heat transfer film t...

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PUM

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Abstract

The invention discloses a heating plate. The heating plate comprises a heating layer, butt sockets, a filling layer and a plate, wherein the butt sockets are arranged on two mounting frames of the plate, the filling layer is positioned between the two mounting frames of the plate in a filling mode, the heating layer is attached to the lower side surface of the plate through pressing of the fillinglayer, and the heating layer is electrically connected with the butt sockets. The heating plate is simple in structure and convenient to maintain and replace.

Description

technical field [0001] The invention relates to the technical field of a decorative plate used for interior decoration, in particular to a plate, a heating plate using the plate and a preparation process thereof. Background technique [0002] At present, floor heating installed indoors in domestic and foreign buildings in winter has become more and more popular and applied. Floor heating is the abbreviation of radiant floor heating. Use the law of the ground's own heat storage and upward radiation to conduct from bottom to top to achieve the purpose of heating. [0003] Although ground radiant heating has incomparable advantages over traditional heating, such as comfort, health, energy saving and environmental protection, there are also many defects in technology and workmanship: [0004] 1. At present, floor heating products at home and abroad mainly include water floor heating and electric floor heating. The entire floor heating system includes: floor heating system, floo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24D3/14F24D19/00F24D19/02E04F15/02E04F15/18
Inventor 刘文晓李树斌
Owner 刘文晓
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