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TO light source packaging device

A technology for packaging devices and light sources, applied in lasers, laser parts, semiconductor lasers, etc., can solve problems such as low tolerance, prolonged working hours, and easy failure, and achieve the goal of reducing production costs, shortening processing time, and widening industrial value Effect

Inactive Publication Date: 2019-07-02
FOCUSLIGHT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The lens bonding structure has low tolerance to high and low temperature environments, and vibration resistance, and is prone to failure.
In the bonding process, it usually takes a long time to cure and bake, which increases the working hours, reduces the production capacity, and indirectly increases the production cost.

Method used

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  • TO light source packaging device
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  • TO light source packaging device

Examples

Experimental program
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Embodiment Construction

[0049] Hereinafter, various embodiments of the present disclosure will be described more fully with reference to the accompanying drawings. The present disclosure is capable of various embodiments, and adaptations and changes are possible therein. Accordingly, the present disclosure will be described in more detail with reference to specific embodiments illustrated in the accompanying drawings. It is to be understood, however, that there is no intention to limit the various embodiments of the present disclosure to the particular embodiments disclosed herein, but that the present disclosure be construed to cover those falling within the spirit and scope of various embodiments of the present disclosure. All adjustments, equivalents and / or alternatives. In conjunction with the description of the drawings, the same reference numerals designate the same elements.

[0050] Hereinafter, the terms "comprising" or "may include" that may be used in various embodiments of the present d...

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PUM

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Abstract

The invention provides a TO light source packaging device. The device includes a TO light source, a plastic lens group and a shell. The plastic lens group is placed in the shell and includes at leastone plastic lens. The TO light source is placed on one end of the shell. The other end of the shell is provided with a light transmission window. Any two or several of the plastic lens group, the TO light source, the shell and the adjacent plastic lenses are connected by a riveting process. On the basis of the structure, when the TO light source packaging is implemented, the TO light source and the plastic lens group can be assembled in one time through the riveting process, which eliminates a conventional lens dispensing process and improves the assembly efficiency. The TO light source packaging device has the advantages of simple assembly, no gelatinization, integration, anti-vibration and high and low temperature resistance.

Description

technical field [0001] The present invention relates to the technical field of semiconductor laser packaging, in particular, to a TO light source packaging device. Background technique [0002] Semiconductor lasers are more and more widely used in medical treatment and industry, especially in the application of laser hair removal. Miniaturization and low cost are the key points in the research of laser light sources in laser hair removal. The laser light source in the form of To packaging has been applied in the communication field, but it is difficult to apply in laser medical treatment and other industries due to its low power and poor optical quality. [0003] In addition, the current semiconductor laser optical system mostly uses lens glue to fix the lens in the system. However, the lens bonding structure has low tolerance to high and low temperature environments, and vibration resistance, and is prone to failure. In the bonding process, it usually takes a long time to...

Claims

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Application Information

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IPC IPC(8): H01S5/022
CPCH01S5/02325
Inventor 蔡磊邢晓绒杨凯刘兴胜
Owner FOCUSLIGHT TECH
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