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Semiconductor laser welding method and semiconductor laser welding structure

A laser welding and semiconductor technology, used in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of solder ball collapse, easy oxidation of solder balls, low bonding strength, etc., to ensure wettability, solve easy problems. Collapse, achieve the effect of protection

Inactive Publication Date: 2019-07-05
苏州福唐智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Existing laser welding usually uses solder balls to vertically interconnect the two electrodes, and then uses laser for melting and reflow, or performs laser thermal bonding of the two components through the bonding layer. The solder balls of the former have poor wettability and are easy to The solder balls collapse and short circuit, and the solder balls are easily oxidized. The latter requires a lot of energy for welding, and the bonding strength is small, which is not conducive to reliability.

Method used

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  • Semiconductor laser welding method and semiconductor laser welding structure
  • Semiconductor laser welding method and semiconductor laser welding structure
  • Semiconductor laser welding method and semiconductor laser welding structure

Examples

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no. 1 example

[0030] see Figure 1-7 , semiconductor laser welding method of the present invention, comprises the following steps;

[0031] 1) see figure 1 , providing a metal plate 1, which has a front side and a back side; the metal plate is a copper plate or an aluminum plate, and its thickness is 0.1-1mm;

[0032] 2) see figure 2 , etching the metal plate 1 to form a base island portion 2 and a pin portion 3, and forming a groove 4 on the front surface of the pin portion;

[0033] 3) forming a nickel plating layer 5 / 6 on the front and back of the pin part 3, the nickel plating layer 5 covering the side wall and bottom surface of the groove 4;

[0034] 4) see image 3 , filling the solidified solder 7 in the groove 4;

[0035] 5) see Figure 4 , wrapping the base island part 2 and the pin part 3 with a resin 8, the resin 8 completely covers the solder 7, and metal solderable particles are mixed in the resin 8;

[0036] 6) Using a laser 9 to make the resin form an opening 10 and m...

no. 2 example

[0041] The semiconductor laser welding method of the second embodiment of the present invention comprises the following steps;

[0042] 1) see figure 1 , providing a metal plate 1, which has a front side and a back side; the metal plate is a copper plate or an aluminum plate, and its thickness is 0.1-1mm;

[0043] 2) see figure 2 , etching the metal plate 1 to form a base island portion 2 and a pin portion 3, and forming a groove 4 on the front surface of the pin portion;

[0044] 3) forming a nickel plating layer 5 / 6 on the front and back of the pin part 3, the nickel plating layer 5 covering the side wall and bottom surface of the groove 4;

[0045] 4) see image 3 , filling the solidified solder 7 in the groove 4;

[0046] 5) see Figure 4 , wrapping the base island part 2 and the pin part 3 with a resin 8, the resin 8 completely covers the solder 7, and a metal complex is mixed in the resin 8;

[0047] 6) Using a laser 9 to make the resin form an opening 10 and mel...

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Abstract

The invention provides a semiconductor laser welding method and a semiconductor laser welding structure. The invention uses laser to activate metal complexes or melt solderable metal particles, so that the protection of solder is realized, the oxidation of the solder is prevented and the wettability of the solder can be ensured. The semiconductor laser welding method and a semiconductor laser welding structure can solve the problem of weak welding strength of a welding layer, and the problems of high probability of collapse and poor wettability of a welding ball.

Description

technical field [0001] The invention relates to semiconductor processing technology, belongs to the H01L23 / 00 classification number, and specifically relates to a semiconductor laser welding method and a welding structure thereof. Background technique [0002] At present, in the manufacture of semiconductor integrated circuits, laser welding is a frequently used process. Laser welding technology is a processing method with no contact, no cutting force, and little thermal influence. It has the advantages of excellent processing quality, high efficiency, wide processing range, cleanliness, good economic benefits, easy implementation of automatic control, flexible processing and intelligent Processing and other characteristics, it solves the problems that cannot be solved by traditional processing technology. Existing laser welding usually uses solder balls to vertically interconnect the two electrodes, and then uses laser for melting and reflow, or performs laser thermal bond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/21B23K26/60B23K26/70
CPCB23K26/21B23K26/60B23K26/702
Inventor 陈洁
Owner 苏州福唐智能科技有限公司
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