Low-temperature conductive copper paste and preparation method thereof

Abstract

The invention relates to a preparation method of low-temperature conductive copper paste. The preparation method is implemented by the steps of (1) preparing a high-molecular polyester resin carrier:adding 30-50% of solid high-molecular polyester resin into 50-70% of a diethylene glycol monoethyl ether acetate solvent; and (2) preparing the copper paste: taking silver-coated copper powder with the average particle size of 5-15 microns and the proper radius-thickness ratio, adding 45-65% of the silver-coated copper powder and 33-53% of the high-molecular polyester resin carrier prepared in thestep (1) into a high-speed dispersing machine for carrying out dispersion to obtain a preliminarily uniform primary carrier, pouring the carrier into a three-roller machine for carrying out grindingand dispersion to obtain a secondary carrier, adding the secondary carrier, 1.6-2% of a closed isocyanate curing agent and 0.1-0.5% of a high-molecular dispersing agent into a planetary stirrer, carrying out vacuumizing and removing bubbles to obtain the conductive copper paste. The preparation method is reasonable in design; various performances such as the conductivity, viscosity, printability,tension and the like of the prepared low-temperature conductive copper paste are excellent; and the requirements of circuit board printing can be met.

Description

technical field [0001] The invention relates to the field of conductive materials, in particular to a low-temperature conductive copper paste and a preparation method thereof. Background technique [0002] The process of printed circuit boards from bare boards to displaying circuit graphics is a relatively complicated process. The most important step is the etching process. The etching is first on the copper foil part that needs to be retained on the outer layer of the board, that is, on the graphic part of the circuit. Pre-plating a layer of anti-corrosion layer, and then chemically corroding the rest of the copper foil leaves the shape of the line. The etching quality includes the consistency of the line width of the line shape and the degree of side etching. Due to the inherent characteristics of the current chemical liquid, Side etching is inevitable, and its severity will lead to the final quality of printed circuit boards. The etching and corrosion efficiency is not hi...

AI Technical Summary

Problems solved by technology

[0002] The process of printed circuit boards from bare boards to displaying circuit graphics is a relatively complicated process. The most important step is the etching process. The etching is first on the copper foil part that needs to be retained on the outer layer of the board, that is, on the graphic part of the circuit. Pre-plating a layer of anti-corrosion layer, and then chemically corroding the rest of the copper foil leaves the shape of the line. The etching quality includes the consistency of the line width of the line shape and the degree of side etching. Due to the inherent characteristics of the current chemical liquid, Side etching is inevitable, and its severity will lead to the final quality of printed circuit boards. The etching and corrosion efficiency is not high. It is used for printed circuit boards of household appliances with smaller volume, and the circuit pattern is more difficult to etch out