Radio frequency chip system-level package structure with sealed casing made of metal and process thereof

Abstract

The invention provides a radio frequency chip system-level package structure with a sealed casing made of metal. The structure comprises a base wafer and a cover plate wafer. The base wafer and the cover plate wafer are bonded together by a wafer-level process, and the outer surfaces of the base wafer and the cover plate wafer are provided with insulating layers. The middle of the base wafer is provided with a TSV hole arrangement area which is internally provided with a plurality of TSV holes arranged in parallel, and the TSV holes penetrate the base wafer in the thickness direction. TSV copper columns are formed in the TSV holes by casting copper, an upper surface of the TSV hole arrangement area is provided with an upper RDL structure, and a lower surface of the TSV hole arrangement area is provided with a lower RDL structure. Upper and lower ends of the TSV copper columns are connected to the upper RDL structure and the lower RDL structure, an upper surface of the upper RDL structure is connected to a functional chip, and the base wafer is provided with a base metal piece outside the hole arrangement area. The invention also provides a package process of the above structure. Making TSV and cavity structures is not needed, and the structure is suitable for mass production.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a radio frequency chip system-level packaging structure in which a metal airtight casing is used. Background technique [0002] Microwave and millimeter wave radio frequency integrated circuit technology is the foundation of modern national defense weaponry and Internet industry. Millimeter-wave radio frequency integrated circuits also have huge actual needs and potential markets. [0003] In the context of the post-Moore's Law era, it has become more difficult to increase integration through the traditional way of reducing the size of transistors. The current electronic system is developing in the direction of miniaturization, diversification, and intelligence, and will eventually form a highly integrated and low-cost comprehensive electronic system that integrates multiple functions such as perception, communication, processing, and transmission. The core technology of...

AI Technical Summary

Problems solved by technology

[0009] However, in practical applications, TSVs for wire bonding and electromagnetic shielding and silicon cavities for embedded chips are required to form a system-in-package structure. These two processes are not only complicated to implement, but also extremely costly. a challenge

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