Direct-insert power device, semiconductor module, hub motor driver or automobile driver and new energy automobile

A power device, in-line technology, used in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as control signal interference

Pending Publication Date: 2019-07-12
SHENZHEN ADVANTAGE POWER LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the development of power semiconductor devices, as the voltage and current increase, their speed beco

Method used

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  • Direct-insert power device, semiconductor module, hub motor driver or automobile driver and new energy automobile
  • Direct-insert power device, semiconductor module, hub motor driver or automobile driver and new energy automobile
  • Direct-insert power device, semiconductor module, hub motor driver or automobile driver and new energy automobile

Examples

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Embodiment 1

[0058] Prepare in-line power devices according to TO-247-4L, and then bend the auxiliary control pins and control signal pins to the first plane where the auxiliary control pins and control signal pins are located and the third plane where the body of the power device is located. The first included angle between the planes is +90 degrees, wherein the power chip is a silicon carbide MOSFET, and the included angle between the second plane where the power pin and the first side of the body is located and the third plane where the body is located is 0 degree, to obtain in-line power devices.

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Abstract

The invention provides a direct-insert power device, a semiconductor module, a hub motor driver or an automobile driver and a new energy automobile. The direct-insert power device comprises: a body comprising a power chip and a wrapping layer wrapping the outer surface of the power chip; a plurality of pins comprising power pins, secondary control pins and control signal pins, each pin comprisinga first section arranged in the wrapping layer and a second section arranged at the outer portion of the wrapping layer, the second section of each secondary control pin and the second section of eachcontrol signal pin are located in a first plane, the second section of each power pin and the first side of the body are located in a second plane, and the first plane is not parallel to the second plane. The direct-insert power device can greatly reduce the mutual crosstalk of a power large current and a control signal, can improve the connection part layout of the main power end, can reduce theparasitic inductance, can greatly increase the system power density, can reduce the system shock and can optimize the parallel consistency.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, relates to in-line power devices, semiconductor components, hub motor drivers or vehicle drivers, and new energy vehicles. Background technique [0002] Discrete in-line power devices, because of their simple design, strong versatility, good delivery time, and high cost performance, are the most widely used packaging types for power devices. However, due to the development of power semiconductor devices, with the increase of voltage and current, its speed is getting faster and faster. The interference of the parasitic inductance on the control signal is also becoming more and more serious. [0003] Therefore, the related technologies of discrete in-line power devices still need to be improved and optimized. Contents of the invention [0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. [...

Claims

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Application Information

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IPC IPC(8): H01L23/49H02M7/00
CPCH01L23/49H02M7/003
Inventor 叶春显詹旭标李涛阮胜超
Owner SHENZHEN ADVANTAGE POWER LTD
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