Force feedback closed-loop control composite bonding device

A closed-loop control, compound key technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problem that the position parameter control cannot meet the strict requirements of the patch

Active Publication Date: 2019-07-19
GUANGDONG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Therefore, simple position parameter control cannot meet the strict requirements of placement. For those skille

Method used

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  • Force feedback closed-loop control composite bonding device
  • Force feedback closed-loop control composite bonding device
  • Force feedback closed-loop control composite bonding device

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Embodiment Construction

[0027] The core of the present invention is to provide a force feedback closed-loop control composite bonding device, which can precisely control the contact force and prevent chips from being crushed.

[0028] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the force feedback closed-loop control composite bonding device of the present invention will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0029] Such as figure 1 As shown, it is a structural diagram of a specific embodiment of the force feedback closed-loop control composite bonding device provided by the present invention; Figure 2A and Figure 2B The front view and side view of a specific embodiment of the force feedback closed-loop control composite bonding device provided by the present invention; the device includes a macro-motion device 1 and a micro-motion device 2, and the micro...

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Abstract

The invention discloses a force feedback closed-loop control composite bonding device. A micro-moving device is driven by a macro-moving device to perform transverse translation and vertical translation; the micro-moving device comprises a giant magnetostrictive actuator, and the length of the giant magnetostrictive actuator is changed to drive a mounting rod to move, and the telescopic amplitudeof the giant magnetostrictive actuator is very small, so that the giant magnetostrictive actuator is used for driving the mounting rod to accurately move in a small range; a strain gauge is used for detecting the contact force between the mounting rod and a substrate; the strain gauge is used for providing feedback for the micro-moving device, and the telescopic amount of the giant magnetostrictive actuator is controlled according to detection signals; when a chip is relatively far away from the substrate, the macro-moving device moves quickly, the macro-moving device is stopped when reachinga relatively close distance from the substrate, the micro-moving device drives the chip to move, and when the chip contacts the substrate, a contact force is generated, and feedback is formed throughthe contact force, so that larger pressure is avoided on the chip; and the macro-moving device or the micro-moving device is used for driving in different stages of mounting, so that the contact force is accurately controlled on the basis of guaranteeing the mounting efficiency, and the chips are prevented from being crushed.

Description

technical field [0001] The invention relates to the technical field of chip flip chip, and further relates to a force feedback closed-loop control composite bonding device. Background technique [0002] A flip chip (Flip chip) is a leadless structure that generally contains circuit units. In the field of chip flip chip, chip bonding is the most critical link in flip chip bonding. During the chip bonding process, the chip is carried by the mounting head and transferred to the substrate. Due to the extrusion between the mounting head and the chip, the larger The impact of force can easily cause cracks on the chip, causing the interconnection between the chip and the antenna to fail; in order to ensure the reliability of the paste package, the placement head needs to place the chip behind the substrate pad and press it with a certain contact force for a period of time, but it cannot The chip is crushed during contact. [0003] The traditional placement head uses the motor to ...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L21/67
CPCH01L21/67253H01L24/75H01L2224/751H01L2224/75301
Inventor 汤晖朱钟源林贻然冯兆阳陈新高健崔成强
Owner GUANGDONG UNIV OF TECH
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