The invention discloses a force feedback closed-
loop control composite bonding device. A micro-moving device is driven by a
macro-moving device to perform transverse translation and
vertical translation; the micro-moving device comprises a giant
magnetostrictive actuator, and the length of the giant
magnetostrictive actuator is changed to drive a mounting rod to move, and the telescopic amplitudeof the giant
magnetostrictive actuator is very small, so that the giant magnetostrictive
actuator is used for driving the mounting rod to accurately move in a
small range; a
strain gauge is used for detecting the
contact force between the mounting rod and a substrate; the
strain gauge is used for providing feedback for the micro-moving device, and the telescopic amount of the giant magnetostrictive
actuator is controlled according to detection signals; when a
chip is relatively far away from the substrate, the
macro-moving device moves quickly, the
macro-moving device is stopped when reachinga relatively close distance from the substrate, the micro-moving device drives the
chip to move, and when the
chip contacts the substrate, a
contact force is generated, and feedback is formed throughthe
contact force, so that larger pressure is avoided on the chip; and the macro-moving device or the micro-moving device is used for driving in different stages of mounting, so that the contact force is accurately controlled on the basis of guaranteeing the mounting efficiency, and the chips are prevented from being crushed.