Novel earphone structure and assembling method

Abstract

The invention discloses a novel earphone structure and an assembling method. The earphone structure comprises a bottom shell, a surface shell which is connected with the bottom shell and forms a cavity, and an earphone assembly which is arranged in the cavity. A loudspeaker unit in the earphone assembly is electrically connected with the main board through elastic pins, a power storage assembly iselectrically connected with the main board through the elastic pins, a charging assembly is electrically connected with the main board through the elastic pins, and the main board is electrically connected with a touch sheet and an antenna through the elastic pins. The earphone structure is simple, reasonable in layout and reliable in connection; during assembly, the earphone assembly is dividedinto four layers to be sequentially installed in an overlapped mode. From the bottom to the top, the first layer is a loudspeaker unit, a magnetic seat and the charging assembly, the second layer is the power storage assembly and a positioning column arranged on the bottom shell and used for positioning and supporting a mainboard, the third layer is a mainboard and microphone combination, the fourth layer is the touch sheet and the antenna, and meanwhile, an elastic pin type electric connection mode is adopted, so that the assembly is simple and convenient, and the production efficiency and the yield are greatly improved.

Description

technical field [0001] The invention relates to the technical field of electronic products and assembly methods, in particular to a novel earphone structure and assembly method. Background technique [0002] In daily life, along with the popularity of portable mobile terminal products, earphones are also widely used in people's daily life. For example, use headphones to listen to music, make chat calls, etc. Usually, in order to allow users to listen to the audio information provided by electronic products clearly and without disturbing others, earphones have become a necessary accessory for electronic products. [0003] Traditional earphones suitable for portable mobile terminals, such as electrostatic earphones, are usually produced and assembled by heat pressing and welding. Or housing and other components are made by hot pressing or buckling. [0004] However, the above-mentioned welding method is slow in assembly, low in work efficiency, and is prone to incomplete co...

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Problems solved by technology

[0004] However, the above-mentioned welding method is slow in assembly, low in work efficiency, and is prone to incomplete connections, resulting in a high rate of defective products. Although the hot pressing method has the advantages of high automation and fast production, it has disadvantages After the heat pressing of the product is completed, when measuring the sound quality, if one of the components is found to be defective, it cannot be disassembled and replaced. The cost of the earphone assembly is relatively expensive. If the whole set is scrapped due to the failure of other components, it is quite uneconomical. At the same time, this method will increase the assembly, cost and risk, and it is not easy to maintain

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