A circuit board cutting and polishing integrated device
A technology for cutting and grinding circuit boards, which is applied in the direction of grinding/polishing safety devices, grinding machines, grinding skateboards, etc., can solve the problems of long production chains and reduce the efficiency of circuit board cutting and processing, so as to improve cutting quality and facilitate subsequent processing Effect
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Embodiment 1
[0021] see Figure 1~4 , in an embodiment of the present invention, a circuit board cutting and polishing integrated device includes a working table 1, a cutting wheel 2 and a grinding wheel 3; A cutting wheel 2 is nested inside, and the cutting wheel 2 extends to the top of the cutting slit 4. The cutting wheel 2 is connected to a driving motor 7 through the first transmission belt 6, and the driving motor 7 is fixedly connected to the supporting leg of the workbench 1; the cutting slit 4 Embedded with a grinding wheel 3, the grinding wheel 3 extends to the top of the cutting seam 4, and the grinding wheel 3 is connected with a driving motor 7 through a second transmission belt 17; the cutting wheel 2 and the grinding wheel 3 are located on the same straight line, and the Carry out cutting first and then grinding, and grind the burrs generated by cutting; a dust box 5 is provided below the cutting seam 4, and the dust box 5 collects debris generated by cutting and grinding. ...
Embodiment 2
[0026] The lower end of the sliding block 9 is fixedly connected with a sliding column 10, and the upper end surface of the workbench 1 is provided with a limiting chute 11, and the sliding column 10 is nested in the limiting chute 11; the limiting chute 11 includes a first horizontal section 1101, the inclined section 1102 and the second horizontal section 1103, the first horizontal section 1101 and the second horizontal section 1103 are arranged in parallel, the first horizontal section 1101 and the second horizontal section 1103 are respectively arranged in parallel with the cutting slit 4, when the clamping mechanism 8 When the circuit board is driven to move to the first horizontal section 1101, the circuit board is cut. When the clamping mechanism 8 drives the circuit board to move laterally and the sliding column 10 moves to the second horizontal section 1103 through the inclined section 1102, the sliding block 9 and the moving The block 13 moves towards each other, and ...
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