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Magnetic heat dissipation device

A technology of heat dissipation device and magnetic force, applied in electromechanical devices, modification by conduction heat transfer, cooling/ventilation/heating renovation, etc. The effect of efficiency

Pending Publication Date: 2019-07-30
大连良华科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the cooling noise of the fan is relatively loud, which affects the user experience
The heat pipe dissipates heat, relying solely on the heat generated by the equipment, and its efficiency is often poor; especially when the room temperature is high, due to the slow heat dissipation of the heat dissipation section of the equipment, the temperature difference of the entire heat dissipation device becomes smaller, and the heat dissipation efficiency will be further reduced; and the heat dissipation no human control

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0021] The cooling device includes an annular sealing pipeline 1, and magnetic liquid is housed in the said annular sealing pipeline 1; said annular sealing pipeline 1 has at least one trumpet-shaped electrified solenoid 2; said annular sealing pipeline Road 1 includes at least one heat absorption section and at least one heat dissipation section. The heat-absorbing section is close to the heat source 6 and absorbs heat; the heat-dissipating section is far away from the heat source 6 and emits heat.

[0022] Direct current is passed into the described energized solenoid 2, and the energized solenoid 2 has a small end and a large end; if there are multiple energized solenoids 2 on the annular sealed pipeline 1, each energized solenoid The small ends of 2 all point to the clockwise or counterclockwise direction of the annular sealed pipeline 1, and the direction of the current flowing into all the energized solenoids 2 is the same. To ensure that all energized solenoids 2 push ...

Embodiment 2

[0026] On the basis of Embodiment 1, the heat dissipation device of this embodiment also includes:

[0027] The heat absorbing section includes heat absorbing fins 3 .

[0028] The heat dissipation section includes heat dissipation fins 4 .

[0029] The heat-absorbing fins 3 and heat-dissipating fins 4 are made of non-magnetic materials.

Embodiment 3

[0031] On the basis of the second embodiment, the difference from the second embodiment is that the heat dissipation section has no heat dissipation fins 4 but a Peltier heat dissipation device 7 . Peltier heat dissipation is also a heat dissipation method for electronic equipment that has been demonstrated and tested. However, when Peltier devices are used for heat dissipation, dew condensation may occur at the cold end, which will cause adverse effects on electronic equipment. In this embodiment, however, the Peltier heat sink 7 is an indirect auxiliary heat sink and is kept away from the electronic device, even if dew condensation occurs, it will not cause harm to the electronic device.

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Abstract

The invention provides a magnetic heat dissipation device. The heat dissipation device comprises an annular sealing pipeline, wherein magnetic liquid is filled in the annular sealing pipeline; the annular sealing pipeline is provided with at least one horn-shaped electrifying solenoid; the annular sealing pipeline comprises at least one heat absorption section and at least one heat dissipation section, and direct current is introduced into the electrifying solenoid. If there are multiple electrifying solenoids on the annular sealing pipeline, the small end of each electrifying solenoid pointsto the clockwise or counterclockwise direction of the annular sealing pipeline, and the current flowing in all electrifying solenoids is in the same direction. The heat dissipation device adopts the horn-shaped electrifying solenoid as power equipment, and works in an active, efficient and silent heat dissipation mode.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and more specifically relates to a magnetic heat dissipation device. Background technique [0002] Many electronic devices will generate a lot of heat when they work, such as the heat generated by the CPU and other components of the computer during high-speed operation, and the heat generated by the light source and circuit board of the projector. These heat will greatly reduce the performance and life of electronic equipment, so how to efficiently dissipate this heat is an important technical issue related to the performance of electronic equipment in many aspects. [0003] Among the current heat dissipation technologies, the most commonly used method is to use a fan for heat dissipation. The fan heat dissipation has the advantages of mature technology and high efficiency. The second is heat pipe heat dissipation, which uses the evaporation and condensation of liquid to achieve heat di...

Claims

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Application Information

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IPC IPC(8): H05K7/20H02K44/06
CPCH05K7/20218H05K7/2039H02K44/06
Inventor 刘孝飞
Owner 大连良华科技有限公司
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