Magnetic heat dissipation device

A technology of heat dissipation device and magnetic force, applied in electromechanical devices, modification by conduction heat transfer, cooling/ventilation/heating renovation, etc. The effect of efficiency

Pending Publication Date: 2019-07-30
大连良华科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the cooling noise of the fan is relatively loud, which affects the user experience
The heat pipe dissipates heat, relying solely on the heat generated by the equipment, and its efficiency is often poor; especially when the room temperature is high, du

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0020] Example one:

[0021] The heat dissipating device includes an annular sealing pipe 1 in which a magnetic liquid is contained; the annular sealing pipe 1 has at least one horn-shaped energizing solenoid 2; the annular sealing pipe The circuit 1 includes at least one heat absorption section and at least one heat dissipation section. The heat absorption section is closer to the heat source 6 and absorbs heat; the heat dissipation section is far away from the heat source 6 and emits heat.

[0022] The energized solenoid 2 is energized with direct current, and the energized solenoid 2 has a small end and a large end; if there are multiple energized solenoids 2 on the ring-shaped sealed pipeline 1, each energized solenoid The small ends of 2 all point to the clockwise or counterclockwise direction of the ring-shaped sealed pipeline 1, and all the energized solenoids 2 have the same direction of current. To ensure that all the energized solenoids 2 push the magnetic liquid in the...

Example Embodiment

[0025] Embodiment two:

[0026] On the basis of Embodiment 1, the heat dissipation device of this embodiment further includes:

[0027] The heat absorption section includes heat absorption fins 3.

[0028] The heat dissipation section includes heat dissipation fins 4.

[0029] The heat absorption fins 3 and the heat dissipation fins 4 are made of non-magnetic materials.

Example Embodiment

[0030] Embodiment three:

[0031] On the basis of the second embodiment, the difference from the second embodiment is that the heat dissipation section does not have the heat dissipation fins 4 but has a Peltier heat dissipation device 7. Peltier heat dissipation is also a heat dissipation method for electronic equipment that has been demonstrated and experimented. However, when the Peltier device is used for heat dissipation, condensation may occur at the cold end, which will cause adverse effects on electronic equipment. In this embodiment, the Peltier heat dissipation device 7 is used as an indirect auxiliary heat dissipation device and is far away from the electronic device, even if condensation is formed, it will not cause harm to the electronic device.

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PUM

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Abstract

The invention provides a magnetic heat dissipation device. The heat dissipation device comprises an annular sealing pipeline, wherein magnetic liquid is filled in the annular sealing pipeline; the annular sealing pipeline is provided with at least one horn-shaped electrifying solenoid; the annular sealing pipeline comprises at least one heat absorption section and at least one heat dissipation section, and direct current is introduced into the electrifying solenoid. If there are multiple electrifying solenoids on the annular sealing pipeline, the small end of each electrifying solenoid pointsto the clockwise or counterclockwise direction of the annular sealing pipeline, and the current flowing in all electrifying solenoids is in the same direction. The heat dissipation device adopts the horn-shaped electrifying solenoid as power equipment, and works in an active, efficient and silent heat dissipation mode.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and more specifically relates to a magnetic heat dissipation device. Background technique [0002] Many electronic devices will generate a lot of heat when they work, such as the heat generated by the CPU and other components of the computer during high-speed operation, and the heat generated by the light source and circuit board of the projector. These heat will greatly reduce the performance and life of electronic equipment, so how to efficiently dissipate this heat is an important technical issue related to the performance of electronic equipment in many aspects. [0003] Among the current heat dissipation technologies, the most commonly used method is to use a fan for heat dissipation. The fan heat dissipation has the advantages of mature technology and high efficiency. The second is heat pipe heat dissipation, which uses the evaporation and condensation of liquid to achieve heat di...

Claims

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Application Information

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IPC IPC(8): H05K7/20H02K44/06
CPCH05K7/20218H05K7/2039H02K44/06
Inventor 刘孝飞
Owner 大连良华科技有限公司
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