Multi-stage corona wind heat dissipation device

Abstract

The invention relates to a multi-stage corona wind heat dissipation device, which comprises a heat sink, a pin electrode group, pore plate electrodes and a high-voltage power supply, wherein the heatsink includes a rib base and ribs expanding the heat dissipation area, and the rib base is contacted with a heat source and fixed on the heat source; the pin electrode group serves as an emitting electrode, is located in rib gaps of the heat sink and has no physical contact with the heat sink; the pore plate electrodes serve as collecting electrodes, are installed on the heat sink in an insulatedmanner, form electrode pairs with the pin electrode group together and has no physical contact with the pin electrode group; and the high-voltage power supply continuously output high voltage, the high voltage end is connected with the pin electrodes to as to provide high voltage for the pin electrodes, and the grounding end is connected with the pore plate electrodes. The multi-stage corona windheat dissipation device provided by the invention can greatly improve the convective heat transfer coefficient of air, thus improves the heat transfer capacity of the heat sink and enables the required area, volume and weight of the heat sink to be reduced; the number of stages of corona discharge can be adjusted according to the length of the heat sink, thereby being applicable to a wider heat power range; and the device has no moving components, is compact in structure and convenient to install, has high reliability and facilitates batch production.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a corona wind heat dissipation device. Background technique [0002] In the heat dissipation process, due to the low convective heat transfer coefficient of the air, compared with the heat conduction thermal resistance of the metal heat sink, the convective heat transfer thermal resistance from the heat sink to the air side is generally very large, which is the bottleneck part of the entire heat dissipation process. . In industries such as power electronics, electronic components, especially semiconductor components, need to work within the rated temperature. Once the temperature is overheated, the life of the components will be greatly reduced, and in severe cases, they will be burned. Therefore, it is necessary for the heat sink to take away the heat emitted by the components in time. Strengthening the heat transfer capacity of the heat sink by increasing the convect...

AI Technical Summary

Problems solved by technology

The fan relies on the motor to drive the fan blades to move at high speed to increase the wind speed, but the moving parts will bring high unreliability, as well as large noise and vibration, which are not good for the work of electronic components

In addition, when the air duct of the heat sink is longer, the wind speed provided by the fan will gradually decay in the flow, and the local convective heat transfer coefficient will become lower and lower along the air flow direction

Connecting fans in multiple stages in series will cause more noise and safety hazards, and will not help increase air volume

Images