A method of improving pcb drilling

A kind of PCB board, modification technology, applied in the direction of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problem of relying on the backing plate or cover plate, etc., to achieve the effect of improving efficiency, realizing automatic operation and reducing occupancy

Active Publication Date: 2021-09-14
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for improving PCB drilling, aiming at solving the problem that the prior art needs to rely on backing plates or cover plates when drilling PCB boards

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  • A method of improving pcb drilling

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Embodiment Construction

[0025] The present invention provides a method for improving PCB board drilling. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] Embodiments of the present invention provide a method for improving PCB drilling, such as figure 1 shown, including steps:

[0027] S100, pre-coating a composite resin material on at least one side of the PCB board, and curing the PCB board, so that the composite resin material coated on the PCB board forms a composite resin layer;

[0028] S200. Drilling the PCB board coated with the composite resin layer;

[0029] S300. Perform film-removing treatment on the drilled PCB board to remove the composite resin layer coated on the PCB board.

[0030] In this embodiment, t...

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Abstract

The invention discloses a method for improving PCB board drilling, wherein the method includes the steps of: directly coating composite resin material on at least one side of the PCB board, and curing the PCB board, so that the coating on the PCB The composite resin material on the board forms a composite resin layer; then the PCB board coated with the composite resin layer is drilled; the PCB board that has been drilled is processed to remove the film, and the coating on the PCB board is removed. Composite resin layer on top. The PCB board coated with the composite resin material and cured by the present invention can be directly placed on the drilling machine table for processing without assembly and tape, which simplifies the operation and improves the efficiency, and the thickness of the coated composite resin material after curing is less than The existing cover plate reduces the occupation of the effective edge length of the drill needle, which is beneficial to chip removal or increased stacking, and is also conducive to the positioning of the drill needle into the drill and improves the machining accuracy.

Description

technical field [0001] The invention relates to the field of PCB drilling, in particular to a method for improving PCB drilling. Background technique [0002] The drilling process is an important process in the manufacture of printed circuit boards (referred to as PCB). The quality of drilling processing directly affects the performance and quality of PCBs, and even affects the overall reliability of electronic devices containing PCBs. The cover plate and backing plate are the key auxiliary materials for PCB drilling. They are usually placed on the upper and lower surfaces of the PCB board to be drilled, placed on the drilling machine table, and attached with adhesive tape around them. The cover plate and The backing plate has the functions of protecting the PCB board surface and the countertop, improving the performance and quality of drilling processing, etc. Commonly used cover plates include aluminum sheets, coated aluminum sheets, cold punched plates, etc. Commonly use...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/28
Inventor 张伦强杨迪张斌王建
Owner SHENZHEN NEWCCESS IND
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