Patch type thermistor and production method thereof
A thermistor and chip-type technology, applied in the direction of resistors, resistor parts, resistors with negative temperature coefficients, etc., can solve the problems of large thickness of silver terminals, environmental pollution, thick glass protective layer, etc. , to achieve the effect of reduced thickness, low material cost and thin thickness
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Embodiment 1
[0015] like figure 1 The first shown embodiment is a chip-type thermistor, including cuboid NTC ceramic particles 1, and the two ends of the NTC ceramic particles 1 are provided with base metal terminals 3 prepared by sputtering base metals by sputtering. The two ends of the ceramic particle 1 are also provided with an electroplating layer covering the end of the base metal, and the four sides of the NTC ceramic particle 1 are covered with a glass protective layer 2 prepared by sputtering organic glass by sputtering.
[0016] The base metal is simple nickel. The electroplated layer includes an electroplated nickel thermal protection layer 4 on the inside and an electroplated tin solderable layer 5 on the outside.
[0017] The thickness of the electroplated nickel thermal protection layer 4 is 8um, and the thickness of the electroplated tin solderable layer 5 is 20um. The base metal terminal 3 has a thickness of 0.20um. The thickness of the protective glass layer 2 is 0.30um...
Embodiment 2
[0027] Embodiment 2, a kind of patch type thermistor, comprises the NTC ceramic particle of cuboid, the two ends of NTC ceramic particle are provided with the base metal terminal that adopts sputtering method sputtering base metal to prepare, and the two ends of NTC ceramic particle are also There is an electroplating layer covering the end of the base metal, and the four sides of the NTC ceramic particles are covered with a glass protective layer prepared by sputtering organic glass by sputtering.
[0028] The base metal is chromium. The electroplating layer includes an electroplated nickel thermal protection layer on the inside and an electroplated tin solderable layer on the outside.
[0029] The thickness of the electroplated nickel thermal protection layer is 6um, and the thickness of the electroplated tin solderable layer is 25um. The thickness of the base metal termination is 0.15um. The thickness of the glass protective layer is 0.40um.
[0030] The external dimensi...
Embodiment 3
[0039] Embodiment three, a kind of patch type thermistor, comprises the NTC ceramic particle of cuboid, and the two ends of NTC ceramic particle are provided with the base metal terminal that adopts sputtering method sputtering base metal to prepare, and the two ends of NTC ceramic particle are also There is an electroplating layer covering the end of the base metal, and the four sides of the NTC ceramic particles are covered with a glass protective layer prepared by sputtering organic glass by sputtering.
[0040] The base metal is copper. The electroplating layer includes an electroplated nickel thermal protection layer on the inside and an electroplated tin solderable layer on the outside.
[0041] The thickness of the electroplated nickel thermal protection layer is 2um, and the thickness of the electroplated tin solderable layer is 3um.
[0042] The thickness of the base metal termination is 0.05um. The thickness of the glass protective layer is 0.05um.
[0043] The ex...
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Abstract
Description
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