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Patch type thermistor and production method thereof

A thermistor and chip-type technology, applied in the direction of resistors, resistor parts, resistors with negative temperature coefficients, etc., can solve the problems of large thickness of silver terminals, environmental pollution, thick glass protective layer, etc. , to achieve the effect of reduced thickness, low material cost and thin thickness

Active Publication Date: 2019-08-09
广州金陶电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are the following problems: 1. The silver terminal is a precious metal, which causes high material cost of the terminal; 2. When the silver terminal is manufactured, the organic matter is discharged during the silver burning process to pollute the environment, the thickness of the silver terminal is relatively large, and there is migration of silver ions at the same time 3. Use silk screen printing and spraying to make the glass protective layer, the thickness of the glass protective layer is relatively thick, the thinnest is 6um

Method used

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  • Patch type thermistor and production method thereof
  • Patch type thermistor and production method thereof
  • Patch type thermistor and production method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] like figure 1 The first shown embodiment is a chip-type thermistor, including cuboid NTC ceramic particles 1, and the two ends of the NTC ceramic particles 1 are provided with base metal terminals 3 prepared by sputtering base metals by sputtering. The two ends of the ceramic particle 1 are also provided with an electroplating layer covering the end of the base metal, and the four sides of the NTC ceramic particle 1 are covered with a glass protective layer 2 prepared by sputtering organic glass by sputtering.

[0016] The base metal is simple nickel. The electroplated layer includes an electroplated nickel thermal protection layer 4 on the inside and an electroplated tin solderable layer 5 on the outside.

[0017] The thickness of the electroplated nickel thermal protection layer 4 is 8um, and the thickness of the electroplated tin solderable layer 5 is 20um. The base metal terminal 3 has a thickness of 0.20um. The thickness of the protective glass layer 2 is 0.30um...

Embodiment 2

[0027] Embodiment 2, a kind of patch type thermistor, comprises the NTC ceramic particle of cuboid, the two ends of NTC ceramic particle are provided with the base metal terminal that adopts sputtering method sputtering base metal to prepare, and the two ends of NTC ceramic particle are also There is an electroplating layer covering the end of the base metal, and the four sides of the NTC ceramic particles are covered with a glass protective layer prepared by sputtering organic glass by sputtering.

[0028] The base metal is chromium. The electroplating layer includes an electroplated nickel thermal protection layer on the inside and an electroplated tin solderable layer on the outside.

[0029] The thickness of the electroplated nickel thermal protection layer is 6um, and the thickness of the electroplated tin solderable layer is 25um. The thickness of the base metal termination is 0.15um. The thickness of the glass protective layer is 0.40um.

[0030] The external dimensi...

Embodiment 3

[0039] Embodiment three, a kind of patch type thermistor, comprises the NTC ceramic particle of cuboid, and the two ends of NTC ceramic particle are provided with the base metal terminal that adopts sputtering method sputtering base metal to prepare, and the two ends of NTC ceramic particle are also There is an electroplating layer covering the end of the base metal, and the four sides of the NTC ceramic particles are covered with a glass protective layer prepared by sputtering organic glass by sputtering.

[0040] The base metal is copper. The electroplating layer includes an electroplated nickel thermal protection layer on the inside and an electroplated tin solderable layer on the outside.

[0041] The thickness of the electroplated nickel thermal protection layer is 2um, and the thickness of the electroplated tin solderable layer is 3um.

[0042] The thickness of the base metal termination is 0.05um. The thickness of the glass protective layer is 0.05um.

[0043] The ex...

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Abstract

The invention relates to a patch type thermistor. The patch type thermistor comprises cuboid NTC ceramic particles, the two ends of the NTC ceramic particles are provided with base metal tips preparedby sputtering base metals by employing a sputtering method, the two ends of the NTC ceramic particles are further provided with electroplated layers wrapping the base metal tips, glass protection layers prepared by sputtering organic glass by employing the sputtering method are wrapped on the four sides of the NTC ceramic particles. According to the invention, 1, the base metal tips are preparedby sputtering base metals by employing the sputtering method at the two ends of the NTC ceramic particles so that the material cost is low, the thickness is thin, no organic matter is discharged in the manufacturing process, and the problem of low reliability caused by ion migration is solved; and 2, the four sides of the NTC ceramic particles are wrapped with the glass protective layers preparedby sputtering organic glass by employing the sputtering method, so that the thickness of the glass protective layers is reduced.

Description

technical field [0001] The invention relates to the field of chip-type thermistors, in particular to a chip-type thermistor and a production method thereof. Background technique [0002] The existing patch type thermistor is mainly composed of a cuboid thermistor ceramic, a glass encapsulation layer, a silver terminal, a nickel barrier layer, and a tin plating layer. There are the following problems: 1. The silver terminal is a precious metal, which causes high material cost of the terminal; 2. When the silver terminal is manufactured, the organic matter is discharged during the silver burning process to pollute the environment, the thickness of the silver terminal is relatively large, and there is migration of silver ions at the same time 3. The glass protective layer is made by screen printing and spraying method, the thickness of the glass protective layer is relatively thick, the thinnest is 6um. Contents of the invention [0003] The purpose of the present invention ...

Claims

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Application Information

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IPC IPC(8): H01C7/04H01C1/02H01C1/148
CPCH01C7/04H01C1/02H01C1/148
Inventor 袁国安
Owner 广州金陶电子有限公司