Wafer flattening equipment

Abstract

The invention discloses wafer flattening equipment. The wafer flattening equipment comprises a main frame, a grinding disc, a grinding head rotating mechanism, a grinding head module, a grinding pad polishing mechanism, a grinding liquid spraying mechanism, a wafer loading and unloading platform, a wafer conveying and transfer platform and a wafer conveying mechanism, wherein a main tabletop is arranged at the middle part of the main frame; the grinding disc is arranged at the middle part of the main tabletop; the bottom of the grinding disc is connected with a rotary driving device; the grinding head rotating mechanism, the wafer loading and unloading platform, the wafer conveying and transfer platform, the grinding pad polishing mechanism and the grinding liquid spraying mechanism are arranged on the side edge of the main tabletop around the grinding disc in sequence; the wafer conveying mechanism is arranged on the side edge of the main tabletop on the outer sides of the wafer loading and unloading platform and the wafer conveying and transfer platform; and the grinding head is connected to the lower end of the grinding head rotating mechanism. The wafer flattening equipment hasthe advantages of simplification of the structure, reduction of the size, reduction of the production cost, reduction of the failure rate, guarantee of the production efficiency, guarantee of stablewafer machining quality and adaption to flattening of wafers of 4 and 6 inches and 3-5 types of products.

Description

technical field [0001] The invention relates to wafer flattening equipment and belongs to the technical field of grinding or polishing devices. Background technique [0002] With the popularization and promotion of mobile technology and smart technology, the demand for microchips in the chip industry continues to expand, and the requirements for equipment capacity of wafer foundry companies are getting higher and higher. CMP (Chemical Mechanical Planarization), that is, chemical mechanical polishing equipment is a key technology in the chip manufacturing process. Relying on CMP equipment, the manufacturing of chips can be expanded from plane to three-dimensional, and the volume of chips can be made smaller and smaller, so it is a very critical process in the wafer processing production chain. [0003] The productivity of the CMP equipment is an important index of the CMP equipment. CMP equipment in the prior art usually consists of a cross turret mechanism, a four-station ...

AI Technical Summary

Problems solved by technology

[0004] The above structure in the prior art has the defects of huge equipment, complicated structure and high production cost

The complex structure leads to a high failure rate, and the whole machine needs to be stopped during maintenance and repair, which affects production efficiency, and the stability of wafer processing quality is poor.

Existing technology is not suitable for planarization processing of 4-inch and 6-inch wafers and 3-5 family products

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