Self-repairing photosensitive resin composition based on mercaptan-alkene and application thereof

A photosensitive resin and composition technology, applied in the field of polymer materials, can solve the problems of lack of photosensitive resin monomer system, photosensitive resin is rare in reports, etc., and achieves excellent self-healing performance, good flexibility, and the effect of overcoming damage.

Active Publication Date: 2019-08-16
LINGNAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the field of photosensitive resins, especially in the field of photocuring rapid prototyping, photosensitive resins with self-healing functions are rarely reported.
The main reason is that the resins with self-healing function reported so far are rarely obtained by photopolymerization, and there is a lack of corresponding photosensitive resin monomer systems.

Method used

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  • Self-repairing photosensitive resin composition based on mercaptan-alkene and application thereof
  • Self-repairing photosensitive resin composition based on mercaptan-alkene and application thereof
  • Self-repairing photosensitive resin composition based on mercaptan-alkene and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Embodiment 1 A kind of composition of photosensitive resin and preparation method thereof

[0061] Under light-shielding conditions, the PU of polyurethane thiol prepolymer monomer 250g 1 -SH (number-average molecular weight 400), 41g of triethylene glycol dimethacrylate, 125g of double bond-containing monomer dithioethanol dimethacrylate, 0.41g of benzphenethanol ketone and 0.41g of p-phenylene Diphenol, stirred evenly to obtain photosensitive resin donor S1.

[0062] Among them, PU 1 The chemical structure of -SH is as follows:

[0063]

Embodiment 2

[0064] Embodiment 2 A kind of composition of photosensitive resin and preparation method thereof

[0065] Under dark conditions, 100g of polyurethane thiol monomer PU 2 -SH (number average molecular weight 4000), 100g of 1,6-hexanediol diacrylate, 100g of double bond-containing monomer dithioethanol diacrylate, 17g of 1-hydroxy-cyclohexyl benzophenone, 17g of Hydroquinone, stirred evenly to obtain photosensitive resin donor S2.

[0066] Among them, polyurethane thiol prepolymer PU 2 The structure of -SH is as follows:

[0067]

Embodiment 3

[0068] Embodiment 3 A kind of composition of photosensitive resin and preparation method thereof

[0069] Under dark conditions, 100g of polyurethane thiol monomer PU 3 -SH (molecular weight 2000), 100g of disulfide bond-containing monomer disulfide 1,6-hexanediol diacrylate, 100g of, 33g of pentaerythritol tetraacrylate, 17g of 2,4,6-trimethyl diacrylate Benzophenone, 17g of hydroquinone, and 3g of benzotriazole were stirred evenly to obtain photosensitive resin donor S3.

[0070] Among them, PU 3 The structure of -SH is as follows:

[0071]

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Abstract

The invention discloses a composition for preparing photosensitive resin with self-repairing function, which comprises the following components in parts by weight: 30-60 parts of polyurethane dithiolmonomer, 0-30 parts of diene monomer, 30-60 parts of diene monomer containing disulfide bonds, 0-10 parts of crosslinking agent, 0.1-5 parts of photoinitiator, 0-1 part of ultraviolet absorbent and 0.1-5 parts of stabilizer. The photosensitive resin is prepare by using that composition for prepare the photosensitive resin with the self-repairing function obtained by the invention, so that the photosensitive resin has the self-repairing function, can repair micro damage in the material in time, has fast repair speed and good repair effect, meanwhile, the polymerization shrinkage is small, the tensile strength is large, and the service life of the material can be effectively prolonged.

Description

technical field [0001] The invention relates to the technical field of polymer materials, more specifically, to a thiol-ene-based self-healing photosensitive resin composition and its application. Background technique [0002] Photosensitive resins can undergo a polymerization reaction under light radiation, from liquid to solid, and are widely used in coatings, light-curing rapid prototyping, dental restoration and other fields. When the photosensitive resin is cured, due to the residual shrinkage stress due to polymerization shrinkage, the material is prone to microcracks and other defects under the action of external force during use. These microscopic defects cause local stress concentration of the material, which will seriously cause the material The macro-fracture of the material seriously shortens the service life of the material. [0003] Self-healing polymer materials are based on the principle of bionics. When a material has a microscopic defect, the material can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G75/045
CPCC08G75/045
Inventor 余彪潘港元伍志勇杨桂珍周晓平张军刘培炼李建鹏宋秀美
Owner LINGNAN NORMAL UNIV
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