Heat dissipation glass and preparation method thereof
A glass and dispersed technology, applied in the direction of modification through heat transfer, cooling/ventilation/heating transformation, etc., can solve the problems of easy shielding of signals, inability to quickly dissipate heat, large thermal conductivity, etc., to achieve broad application prospects and improve speed. , the effect of reducing the frequency of fever
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Embodiment 1
[0037] This embodiment provides a heat dissipation glass, such as figure 1 As shown, its structure includes a glass body 10 and several heat conduction holes 20 dispersedly arranged in the glass body 10 to form a chamber 11 for rapid heat dissipation in the heat conduction holes 20 .
[0038] Wherein, in this embodiment, in order to optimize the heat dissipation effect, in the heat conduction area, the distance between each of the heat conduction holes is greater than 50 microns. Preferably, the distance from the edge of each heat conduction hole to the edge of another hole is preferably 100 microns to 10 mm, more preferably 1 mm to 5 mm.
[0039] In order not to affect the visual effect of the glass itself, the size of the thermal conduction hole is preferably larger than 5 microns. Preferably, the diameter of the heat conduction hole is preferably 10 micrometers to 10 millimeters; further, the diameter of the heat conduction hole is preferably 100 micrometers to 5 millimete...
Embodiment 2
[0049] The difference between this embodiment and Embodiment 1 is that in this embodiment, the heat dissipation glass further includes a heat conduction plug.
[0050] Such as Figure 4 As shown, the present embodiment provides a medium heat dissipation glass, including a glass body 10 and a plurality of heat conduction holes 20 dispersedly arranged in the glass body 10 , and the heat conduction holes 20 are filled with heat conduction plugs 30 .
[0051]Wherein, the material of the thermal plug 30 is different from the glass body; for example, the material of the thermal plug 30 is selected from at least one of aluminum, silver, gold, tin, copper, graphite, graphene, carbide or nitride powder . Preferably, for the thermal plug obtained from the above materials, the thermal conductivity of the thermal plug is 5 times or more than the thermal conductivity of the glass body, for example, a material with a thermal conductivity greater than or equal to 5.0 W / mK is preferred. Thi...
Embodiment 3
[0054] This embodiment provides the preparation method of the heat dissipation glass involved in Embodiment 1 and Embodiment 2, comprising the following steps:
[0055] S1, providing a glass substrate as a glass body. In this embodiment, a common glass body is used.
[0056] S2, forming several heat conduction holes on the glass body.
[0057] Specifically, the etching drilling method can be used in this step. The preparation steps include: coating a photoresist on the glass body, performing exposure, development, etching, and film removal steps in sequence according to a preset pattern, and obtaining several Thermal hole. The heat conduction hole may be a through hole or a blind hole.
[0058] In addition, there may be other punching methods in this step.
[0059] Another example is the mechanical drilling method, and the preparation step includes: obtaining several heat conduction holes on the glass body by machine impacting according to a preset pattern on the glass bod...
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Abstract
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