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laser cutting method

A laser cutting and laser beam technology, applied in laser welding equipment, welding/cutting auxiliary equipment, auxiliary welding equipment, etc., can solve the problems of increasing cost, easily generating debris, increasing process, etc., to improve yield and uniform thermal stress , to avoid the effect of fragmentation

Active Publication Date: 2021-06-25
SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, the above-mentioned cut glass workpieces are prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the process and increases the cost.
At the same time, the laser is used to process glass workpieces, the process is complex and fragments are prone to occur during the slitting process, which reduces the processing yield

Method used

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] It should be noted that when an element or component is considered to be “connected” to another element or component, it may be directly connected to the other element or component or there may be an intervening element or component at the same time. When an element or component is referred to as being "disposed on" another element or component, it can be directly disposed on the other element or component or intervening elements or compone...

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Abstract

The present invention proposes a laser cutting method, which includes the following steps: providing a laser cutting device, the laser cutting device includes a machine table, a transmission mechanism, a cutting mechanism, a static mechanism and a split mechanism, the cutting mechanism includes a mobile platform and a laser cutter, The split mechanism includes a fixed jig and at least one heating laser; the transfer mechanism picks and places the workpiece on the mobile platform; the laser cutter emits a laser beam to pre-cut the workpiece on the mobile platform and form a pre-cut line; the transfer mechanism pre-cuts the workpiece on the mobile platform. The cut workpiece is taken from the mobile platform to the static mechanism and rested for a preset time; the transmission mechanism takes the static workpiece from the static mechanism to the fixed fixture; each heating laser emits a laser beam The workpiece located on the fixed jig is heated along the pre-cutting line, so that the workpiece is split along the pre-cutting line under the impact of thermal stress to realize the cutting of the workpiece. The above-mentioned laser cutting method has a high cutting yield.

Description

technical field [0001] The invention relates to a cutting method, in particular to a laser cutting method for cutting glass workpieces. Background technique [0002] Existing glass cutting equipment mainly adopts traditional glass cutters to cut workpieces. However, the above-mentioned cut glass workpiece is prone to edge chipping, and the edge strength of the glass workpiece is weak, and subsequent CNC cutting processing is required, which increases the manufacturing process and increases the cost. At the same time, the laser is used to process glass workpieces. The process is complex and fragments are prone to occur during the slitting process, which reduces the processing yield. Contents of the invention [0003] In view of the above situation, it is necessary to provide a laser cutting method with high cutting yield. [0004] A kind of laser cutting method, it comprises the following steps: [0005] A laser cutting device is provided, the laser cutting device includ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/70B23K37/04
CPCB23K26/38B23K37/0435B23K26/702
Inventor 王有德杨关伟张红岩丁培
Owner SHENZHENSHI YUZHAN PRECISION TECH CO LTD
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