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Preparation method of copper sulfide/polyaziridine/polyacrylonitrile composite conductive material

A polyacrylonitrile and polyaziridine technology is applied in the field of preparation of copper sulfide/polyaziridine/polyacrylonitrile composite conductive materials, which can solve the problem of weak bonding between copper sulfide and matrix, poor stability of composite conductive materials, and poor surface Uneven dispersion and other problems, to achieve outstanding wear resistance and solvent resistance, electromagnetic shielding and flexibility, improved adhesion

Active Publication Date: 2019-09-06
ZHONGYUAN ENGINEERING COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the complexing ability of the cyano group in polyacrylonitrile to copper ions is limited, and the copper sulfide / polyacrylonitrile composite conductive material prepared by this method often has problems such as weak bonding between copper sulfide and the matrix, and uneven surface dispersion. As a result, the composite conductive material has poor stability and low conductivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The preparation method of the copper sulfide / polyethylenimine / polyacrylonitrile composite conductive material of the present embodiment, the steps are as follows:

[0024] (1) Put 20 grams of polyacrylonitrile in 80 grams of dimethylformamide and stir at 70°C for 2.5 hours to completely dissolve the polyacrylonitrile to obtain a polyacrylonitrile dimethylformamide solution;

[0025] (2) Add 10 grams of 50% polyethylenimine crosslinking agent aqueous solution dropwise to the polyacrylonitrile dimethylformamide solution obtained in step (1), and stir at 80°C for 2 hours to obtain polyethylenimine Pyridine cross-linking agent / polyacrylonitrile blended solution, after standing for degassing, polymer casting solution is obtained,

[0026] (3) Cast the film casting solution in step (2) onto a glass plate, scrape it with a scraper to form a liquid film with a thickness of 800 microns, and immerse the glass plate with the liquid film in dimethylformamide concentration at 60°C ...

Embodiment 2

[0029] The preparation method of the copper sulfide / polyethylenimine / polyacrylonitrile composite conductive material of the present embodiment, the steps are as follows:

[0030] (1) Put 10 grams of polyacrylonitrile in 90 grams of dimethylformamide and stir at 60°C for 3 hours to completely dissolve the polyacrylonitrile to obtain a solution of polyacrylonitrile in dimethylformamide;

[0031] (2) Add 5 grams of 30% polyethylenimine crosslinking agent aqueous solution dropwise to the polyacrylonitrile dimethylformamide solution obtained in step (1), and stir at 60°C for 3 hours to obtain polyethylenimine Pyridine cross-linking agent / polyacrylonitrile blended solution, after standing for degassing, polymer casting solution is obtained,

[0032] (3) Cast the film casting solution in step (2) onto a glass plate, scrape it into a liquid film with a thickness of 200 microns with a scraper, and immerse the glass plate with the liquid film in dimethylformamide concentration at 20°C ...

Embodiment 3

[0035] The preparation method of the copper sulfide / polyethylenimine / polyacrylonitrile composite conductive material of the present embodiment, the steps are as follows:

[0036] (1) Put 10 grams of polyacrylonitrile in 90 grams of dimethylformamide and stir at 80°C for 2 hours to completely dissolve the polyacrylonitrile to obtain a solution of polyacrylonitrile in dimethylformamide;

[0037] (2) Add 15 grams of an aqueous solution of polyaziridine crosslinking agent with a concentration of 80% dropwise to the polyacrylonitrile dimethylformamide solution obtained in step (1), and stir at 70°C for 2.5 hours to obtain polyaziridine Propidium crosslinking agent / polyacrylonitrile blended solution, after standing for degassing, polymer casting solution is obtained,

[0038] (3) Cast the film casting solution in step (2) onto a glass plate, scrape it with a scraper to form a liquid film with a thickness of 400 microns, and immerse the glass plate with the liquid film in dimethylforma...

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Abstract

The invention relates to the field of composite conductive materials, and especially relates a preparation method of a copper sulfide / polyaziridine / polyacrylonitrile composite conductive material. Thepreparation method comprises the following steps: mixing of a dimethylformamide solution of polyacrylonitrile with an aqueous solution of the polyaziridine crosslinking agent, film coating, immersionin a coagulation bath solution for solidification, and a chemical reaction process for preparing the copper sulfide / polyaziridine / polyacrylonitrile composite conductive material. A polyacrylonitrilefilm blend-modified with the polyaziridine crosslinking agent has a good flexibility, and water in the aqueous solution of the polyaziridine crosslinking agent acts as a pore forming agent in the process of film formation. The polyaziridine crosslinking agent / polyacrylonitrile film has a continuously distributed network pore structure, so the conductive copper sulfide is deposited on the surface of the flexible film, also grows in the flexible film, and the formed copper sulfide can cover the surface of the flexible substrate film and penetrates into the film to truly complete the effective loading of the copper sulfide, thereby the composite material has an excellent conducting performance.

Description

technical field [0001] The invention relates to the field of composite conductive materials, in particular to a method for preparing a copper sulfide / polyethylenimine / polyacrylonitrile composite conductive material. Background technique [0002] Polymer materials are light in weight, cheap, superior in mechanical and electrical insulation properties, convenient in processing, and safe in use, so they have achieved rapid development and wide application. Polymer material facilitates people's life because of its excellent insulation, but it also brings many troubles and even disasters. In recent years, with the rapid development of electronic devices and large-scale integrated circuits, the hazards of static electricity and electromagnetic waves have become more prominent. Therefore, it is of great practical significance to change the insulation properties of polymer materials. [0003] To make conventional polymer materials antistatic, researchers have used metals, graphene...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08J3/24C08J7/12C08L33/20C08L79/02C08K3/30
CPCC08J3/24C08J5/18C08J7/12C08J2333/20C08J2479/02C08K2003/3009
Inventor 裴海燕潘玮曲良俊陈燕刘红燕张艳丽
Owner ZHONGYUAN ENGINEERING COLLEGE
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