Automatic laser soldering machine

A soldering machine and automatic welding technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems affecting the properties of thermal elements, and achieve the effect of reducing production costs

Pending Publication Date: 2019-09-10
广东费斯柯自动化科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides an automatic laser soldering machine, which has the advantages of strong adaptability, more energy saving, and high welding quality, and solves the problem that the traditional soldering machine will continuously heat the solder joints and affect the properties of the thermal element. And the need to replace the soldering iron tip

Method used

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  • Automatic laser soldering machine
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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0024] see Figure 1-3 , an automatic laser soldering machine, including a console device 1 and a soldering device 2, the top of the console device 1 is fixedly installed with the soldering device 2.

[0025] The operating table device 1 includes a soldering machine operating table 101, and both sides of the soldering machine operating table 101 are fixedly installed with connecting bosses 102, and a switch 103 is fixedly installed on the front surface of the soldering machine operating table 101, and a switch 103 is fixedly installed above the switch 103. Adjusting knob 104, the left and right sides of adjusting knob 104 are all fixedly installed with several operating buttons 105, and adjusting knob 104 and operating buttons 105 are all fixedly installed on the front surface...

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Abstract

The invention relates to the technical field of laser soldering, and discloses an automatic laser soldering machine. The automatic laser soldering machine comprises an operation table device and a tinsoldering device, the top of the operation table device is fixedly provided with the tin soldering device, and the operation table device comprises a tin soldering machine operation table; connectingbosses are fixedly arranged on the two sides of the soldering machine operation table, a switch is fixedly arranged on the front surface of the tin soldering machine operation table, and a pluralityof operation buttons are fixedly arranged on the left side and the right side of the adjusting knob. The automatic laser soldering machine has the advantages of being short in heating time, fast in heating speed and small in influence on the property of surrounding devices due to local heating. During laser soldering tin, only the part irradiated by the light spot is heated by the laser, the localtemperature rises is faster, so that the welding spot can be quickly made to reach the temperature of the welding requirement, due to the fact that the temperature rise is fast and the time is short,and the temperature rise of the surrounding area of the welding spot is limited, so that the influence on other elements is relatively small.

Description

technical field [0001] The invention relates to the technical field of laser soldering, in particular to an automatic laser soldering machine. Background technique [0002] Solder is an important industrial raw material for connecting electronic components in welding lines. It is a kind of solder with a low melting point. It mainly refers to solder made of tin-based alloys. The production method of solder is to make ingots by melting method first, and then press them into materials. Solder is widely used in electronics industry, home appliance manufacturing, automobile manufacturing, maintenance industry and daily life. As we all know, soldering is to heat all the workpieces or a large area or a single individual on substrates such as circuit boards, wires, and electronic devices through high-temperature airflow, high-temperature liquid, or high-temperature solid heat conductors, so that the nearby solder is in the flux. With the assistance, it becomes a fluid state or a li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/005
CPCB23K1/0056
Inventor 罗雄
Owner 广东费斯柯自动化科技有限公司
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