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A segmented semiconductor refrigeration chip

A technology for semiconductors and refrigerating chips, applied in the field of semiconductor refrigerating chips with segmented structure, can solve the problem of lack of integral research on the number of segments, and achieve the maximum cooling temperature difference and the improvement of cooling capacity, cooling coefficient and cooling temperature difference. Effect

Active Publication Date: 2020-10-02
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, the main focus is on the physical parameter arrangement of each internal segment, or only the influence of a single factor on the number of segments is studied, and there is a lack of holistic research on the interaction between the number of segments and other external factors

Method used

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  • A segmented semiconductor refrigeration chip
  • A segmented semiconductor refrigeration chip
  • A segmented semiconductor refrigeration chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] In this embodiment, on the basis of the semiconductor refrigeration sheet TEC12706, the thermoelectric arm in the refrigeration unit is divided into two sections. The length ratio of the P-type cold-end thermoelectric arm section 7 to the P-type hot-end thermoelectric arm section 8 is 1:1, and the length ratio of the N-type cold-end thermoelectric arm section 9 to the N-type hot-end thermoelectric arm section 10 is 1:1 . That is, the length of each section is 0.75mm, and its semiconductor materials are bismuth telluride and its alloys.

[0042] Such as figure 2 As shown, under the condition that the overall thermoelectric figure of merit (ZT) remains unchanged, the ratio of Seebeck coefficient (S h / S c ) On the overall performance. Experiments have shown that the ratio of Seebeck coefficient of the hot and cold end thermoelectric arms (S h / S c When) is 1, the maximum coefficient of refrigeration (COP) can be reached.

Embodiment 2

[0044] In this embodiment, the overall thermoelectric figure of merit (ZT) value remains unchanged, and the ratio of Seebeck coefficient (S h / S c ) Is 1, the thermal conductivity and resistivity of the two sections have an effect on the overall cooling performance, such as image 3 with Figure 4 Shown. Experiments show that the resistivity ratio of the thermoelectric arm section at the hot and cold ends (ρ h / ρ c ) And the ratio of thermal conductivity (λ h / λ c When) is 6 or more, higher refrigeration performance can be achieved, and the required physical property gap is smaller.

Embodiment 3

[0046] In this embodiment, under the condition that the total thermoelectric arm length is unchanged, the Seebeck coefficient ratio (S h / S c ) Is 1, the resistivity of the thermoelectric arm section at the hot and cold ends (ρ h / ρ c ) And the thermal conductivity ratio (λh / λc) of the hot and cold end thermoelectric arm sections (λh / λc) is 6, the effect of the change in the ratio of the best cold end thermoelectric arm length to the total length on the cooling performance, such as Figure 5 Shown. Experiments show that in L c When / L is 0.8, that is, the ratio of the length of the P-type cold-end thermoelectric arm section (7) to the P-type hot-end thermoelectric arm section (8) is 4:1, and the N-type cold-end thermoelectric arm The ratio of the length of the section (9) to the length of the N-type hot-end thermoelectric arm section (10) is 4:1, and the overall refrigeration performance is the best. It can increase the refrigeration capacity by 151.8%, increase the refrigerati...

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Abstract

The invention relates to the technical field of semiconductor refrigeration, and particularly discloses a semiconductor chilling plate with a sectional structure. The semiconductor chilling plate comprises a plurality of semiconductor chilling plate units, each semiconductor chilling plate unit correspondingly comprises a cold end base plate and a hot end base plate which are arranged up and down, a cold end conductive copper is arranged on the lower surface of the cold end base plate, two hot end conductive copper sheets are arranged on the upper surface of the hot end base plate, a P-type thermoelectric arm is arranged between the cold end conductive copper sheet and one of the hot end conductive copper sheets, and a N-type thermoelectric arm is arranged between the cold end conductive copper sheet and the other hot end conductive copper sheet. According to the semiconductor chilling plate with the sectional structure, semiconductor thermoelectric materials with different material ratios are combined into a thermoelectric unit, so that the thermoelectric optimal value of the semiconductor thermoelectric materials in each section is in different temperature zones along the length direction of the thermoelectric arms, the semiconductor material segments with different properties can work in the optimal state, and the refrigeration performance of a whole thermoelectric refrigerating unit is improved, and meanwhile, the cost is reduced.

Description

Technical field [0001] The present invention relates to the technical field of semiconductor refrigeration, and more specifically, to a semiconductor refrigeration sheet with a segmented structure. Background technique [0002] The rapid development of social productivity is accompanied by ever-increasing energy consumption. The over-exploitation and consumption of non-renewable energy have caused energy shortages and also caused a series of environmental problems. The dilemma of energy shortages and the deterioration of the living environment have caused people to start Change the old concept of energy consumption and strengthen the awareness of environmental protection. Efficient, clean, and environment-friendly energy utilization methods are replacing inefficient and polluting energy consumption methods, and have gradually become a new development trend. Because the fluorine-containing refrigerant used in traditional compression refrigeration technology will cause a destructi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02
CPCF25B21/02
Inventor 申利梅许珅鸣张文帅王玉鹏李惠琳
Owner HUAZHONG UNIV OF SCI & TECH
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