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Semiconductor device and forming method thereof

A semiconductor and device technology, applied in the field of semiconductor devices and their formation, can solve the problems of poor performance of semiconductor devices, insufficient exposure and color saturation, reduce dark current, reduce the generation of photogenerated carriers, and improve picture quality. Effect

Inactive Publication Date: 2019-09-20
HUAIAN IMAGING DEVICE MFGR CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the color black-and-white semiconductor device, when the pictures taken by the color image sensor and the black-and-white image sensor are synthesized, there will be problems such as overexposure and insufficient color saturation under strong light, which will lead to poor performance of the semiconductor device.

Method used

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  • Semiconductor device and forming method thereof
  • Semiconductor device and forming method thereof
  • Semiconductor device and forming method thereof

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Embodiment Construction

[0029] As described in the background, prior art semiconductor devices have poor performance.

[0030] refer to figure 1 , figure 1 It is a structural schematic diagram of a semiconductor device, the semiconductor device includes: a plurality of color pixel units A and a plurality of black and white pixel units B located on the surface of a substrate 100, and the color pixel units A and black and white pixel units B include: interconnection layer 120, a photosensitive layer 110 and a light-receiving structure, the substrate 100 has an opposite first surface and a second surface; The light-receiving structure is located on the second surface of the substrate 100, the light-receiving structure includes a lens layer 160, a filter layer and a grid layer 140, the lens layer 160 is located on the surface of the filter layer, and the grid layer 140 is located on the adjacent surface. between the filter layers; the image sensor further includes a carrier plate 130 located on the sur...

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Abstract

The invention relates to a semiconductor device and a forming method thereof. An image sensor comprises a substrate, a first light sensitive layer, a second light sensitive layer, a second light filtering layer and a plurality of first light filtering layers, wherein the substrate comprises a black-and-white pixel area and a colorful pixel area; the substrate has a first surface and a second surface which are opposite to each other; the first light sensitive layer is positioned in the black-white pixel region of the substrate; the second light sensitive layer is located in the colorful pixel area of the substrate; the second light filtering layer is located on the surface of the second surface of the colorful pixel area of the substrate, and the second light filtering layer allows monochromatic light to pass through; the first light filtering layers are located on the surface of the second surface of the black and white pixel area of the substrate, the first light filtering layers are made of transparent materials, and a photosensitizer is doped in the first light filtering layers; when the luminous flux of the incident light entering the first light filtering layers is larger than a preset value, the photosensitizer color is changed, and the first light filtering layers are changed to form a third light filtering layer, and the third light filtering layer allows monochromatic light to pass through; and when the luminous flux of the incident light entering the first light filtering layers is less than or equal to the preset value, the first light filtering layer allows natural light to pass through. The performance of the semiconductor device is improved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor device and a forming method thereof. Background technique [0002] With the development and progress of science and technology, smart electronic products are becoming more and more popular. With the popularization of smart electronic products, users have higher and higher requirements for the types of functions and performance of smart electronic products, such as camera functions and camera functions. [0003] For the camera function of smart electronic products, the camera solution with a single camera can no longer meet the growing demand for camera, so the camera solution with dual cameras. At present, dual cameras are widely used in various electronic terminals or devices such as mobile phones, tablet computers, cameras, and vehicle-mounted computers. Dual cameras refer to the combination of dual color lenses, color black and white lenses or wide-...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/146H01L27/14605H01L27/14621H01L27/14625H01L27/14683H01L27/14685
Inventor 张东亮陈世杰黄晓橹
Owner HUAIAN IMAGING DEVICE MFGR CORP
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