Micro light emitting diode and display panel

Abstract

The invention provides a micro light emitting diode (101) and a display panel (300). The micro light emitting diode (101) comprises a light conversion layer (120) used for converting blue light into white light, a black matrix (110) arranged in the light conversion layer (120), a buffer layer (130) arranged on the light conversion layer (120), a first semiconductor layer (140) arranged on the buffer layer (130), an indium gallium nitride layer (150) arranged on the first semiconductor layer (140), a second semiconductor layer (160) arranged on the indium gallium nitride layer (150), a current spreading layer (170) arranged on the second semiconductor layer (160) and used for widening the light-emitting area, a passivation layer (180) arranged on the current spreading layer (170) and the buffer layer (130), a first cushion (190) and a second cushion (195).

Description

technical field [0001] The present application relates to the display field, in particular to a micro light emitting diode and a display panel. Background technique [0002] Nowadays, in order to pursue self-illumination to increase contrast and develop towards flexible displays, liquid-crystal displays (abbreviation: LCD) are developing towards organic electroluminescence displays (Organic Electroluminescence Display, abbreviation: OELD), OLED The advantage is that it can self-illuminate to meet the display requirements, does not require liquid crystals, and can make flexible and flexible displays, which is quite popular in the current stage of development. However, the disadvantages of OLED displays are that the manufacturing process is difficult, and the evaporation process and packaging process have not yet been optimized, followed by low process yield and increased production costs. [0003] At present, the industry uses Micro Light Emitting Diode Display (Micro LED fo...

AI Technical Summary

Problems solved by technology

However, because organic light emitting diodes are small in size and densely arranged, it is more difficult to apply the traditional manufacturing process to micro light emitting diodes to make display devices by single-sided printing, and the process of pasting and transposition is limited by the accuracy of the mechanism 1. The material properties of the stamp and the accuracy of the unit pitch (pitch) limit the resolution of the product, and when one side is pasted in a high-density arrangement, it is easy to generate interference from adjacent micro-LEDs during placement transposed, thus causing misplacing

[0006] In the active matrix drive display device (Active matrix, AM microLED), since the size of the micro-light-emitting diode display is usually smaller than 100um; its size exceeds the size of the traditional grabbing head, and the traditional binning cannot be used (bin) The machine divides the brightness, chromaticity, wavelength and voltage of the micro-light-emitting diode display chip into bins (bin), resulting in the micro-light-emitting diode display applied on the same display panel due to voltage, brightness, wavelength, and chromaticity. There are great differences, resulting in quality problems such as light and dark, color cast, and color spots

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