Film-forming method, film-forming apparatus, manufacturing method of element structure, and manufacturing apparatus of element structure

Abstract

The film-forming method of the present invention forms a film of a resin material by spraying a liquid resin material onto a heating portion and vaporizing it, and supplying the vaporized vapor to a substrate. The film-forming conditions are controlled in such a manner that the vaporization rate of the resin material decreases according to the cumulative amount of vaporization that is the total amount of the resin material supplied to the heating unit.

Description

technical field [0001] The present invention relates to a method for forming a film, a device for forming a film, a method for manufacturing an element structure, and a device for manufacturing an element structure, and in particular to a technology suitable for manufacturing an element structure that has a chemical reaction from oxygen or moisture. Laminated structures such as protective devices, etc. [0002] This application claims priority based on Patent Application No. 2017-030318 filed in Japan on February 21, 2017, and uses the content thereof here. Background technique [0003] An organic EL (Electro Luminescence, electroluminescence) element etc. are known as an element containing the compound which has a property which tends to deteriorate by moisture, oxygen, etc., for example. With regard to such devices, attempts have been made to suppress intrusion of moisture or the like into the device by forming a laminated structure in which a layer containing a compound ...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the gasification efficiency deteriorates with time, and when the supply amount of the resin material to the vaporizer is constant, the amount of steam supplied from the vaporizer to the film formation chamber is also constant. Decrease gradually, the deposition rate (film formation rate) gradually deteriorates

In particular, there is a problem that when the processing time becomes longer, the film formation state becomes unstable due to a decrease in the gasification efficiency.

[0006] In addition, since sufficient vapor of the resin material is not supplied to the film forming device, there is a possibility that the film cannot be formed sufficiently.

In this case, there is a problem that when unevenness and the like are formed on the surface of the substrate having the device layer, the unevenness cannot be sufficiently covered, and for example, poor coverage may occur at the boundary portion of the unevenness.

If such poor coverage of the inorganic film occurs, it will be difficult to secure sufficient barrier properties because moisture intrusion from the poor coverage site cannot be prevented.

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