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Package substrate and airtight package using same

A hermetic packaging and packaging technology, which is used in semiconductor/solid-state device parts, electrical components, electrical solid-state devices, etc., and can solve the problems of thermal degradation of internal components and high softening temperature of glass powder.

Pending Publication Date: 2019-09-20
NIPPON ELECTRIC GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the softening temperature of glass powder is higher than that of organic resin-based adhesives, internal components may be thermally degraded during sealing.

Method used

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  • Package substrate and airtight package using same
  • Package substrate and airtight package using same
  • Package substrate and airtight package using same

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Embodiment Construction

[0035] The package base of the present invention has a substantially rectangular base and a substantially frame-shaped frame provided along the outer periphery of the base. In this way, internal components such as sensor elements can be accommodated easily in the frame portion of the package base. In addition, the effective area for functioning as a device can be enlarged.

[0036] In the package base of the present invention, the stress buffering portion is provided at all or a part of the inner wall corners of the frame portion, and preferably, the stress buffering portion is provided at all the inner wall corners of the frame portion. In this way, deformation and cracks are less likely to occur in the package base after firing and sintering the precursor of the package base.

[0037]Preferably, the stress buffering portion is arc-shaped when viewed from the top side of the frame portion, and has an arc-shape with a curvature radius of 0.5 mm or more, 1.0 mm or more, partic...

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Abstract

A package substrate is characterized by having a substantially rectangular base section, and a substantially frame-shaped frame section that is provided along the perimeter of the base section, and by having a stress buffer section at all or a portion of inner wall corner sections of the frame section.

Description

technical field [0001] The present invention relates to a package base and a hermetic package using the package base, and more specifically, to a package base having a cavity for accommodating internal components and a hermetic package using the package base. Background technique [0002] A hermetic package generally includes a package base, a light-transmitting glass cover, and internal elements housed in the above components. [0003] Internal elements such as sensor elements mounted inside the hermetic package may be degraded by moisture infiltrated from the surrounding environment. Conventionally, in order to integrate the package base and the cover glass, an organic resin-based adhesive having low-temperature curability has been used. However, since organic resin-based adhesives cannot completely shield moisture and gas, internal components may deteriorate over time. [0004] On the other hand, if a sealing material containing glass powder and refractory filler powder...

Claims

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Application Information

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IPC IPC(8): H01L23/04H01L23/02H01L23/08
CPCH01L23/02H01L23/04H01L23/08H01L23/10H01L23/31H01L23/562H01L23/564
Inventor 广濑将行马屋原芳夫
Owner NIPPON ELECTRIC GLASS CO LTD
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