Polyarylene sulfide resin composition, molded article thereof, and surface mount electronic component

A technology of resin composition and electronic components, which is applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., can solve the problems of melting or deformation of electronic components, and achieve the effect of suppressing gas generation and excellent mechanical strength

Active Publication Date: 2019-09-27
DIC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when soldering resin-based electronic components such as connectors, there is a problem that the electronic components are melted or deformed in a heating furnace (reflow furnace).

Method used

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  • Polyarylene sulfide resin composition, molded article thereof, and surface mount electronic component
  • Polyarylene sulfide resin composition, molded article thereof, and surface mount electronic component
  • Polyarylene sulfide resin composition, molded article thereof, and surface mount electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0122] Hereinafter, an Example is given and this invention is demonstrated further concretely. However, the present invention is not limited to these Examples.

[0123] 1. Evaluation method

[0124] [Bending characteristics]

[0125] ·Standard test method…ASTMD-790

[0126] ・Test piece…3.2mm (thickness)×12.7mm (width)×127mm (length)

[0127] ・Test results...the average value of the number of tests n=10

[0128] [hot water resistance]

[0129] The test piece was immersed in 95 degreeC hot water, and the change with time of the bending strength was examined.

[0130] ・Test piece…3.2mm (thickness)×12.7mm (width)×127mm (length)

[0131] ·Test method for flexural strength…ASTM D-790

[0132] ・Evaluation items... Retention of flexural strength after 1000 hours and 3000 hours with respect to initial strength

[0133] ・Test results...the average value of the number of tests n=5

[0134] [Metal adhesion strength]

[0135] Inject a polyarylene sulfide resin composition of the ...

Synthetic example 1

[0153] (Synthesis Example 1: Synthesis of PPS-1)

[0154] 300.0 g of p-diiodobenzene (Tokyo Chemical Co., Ltd., p-diiodobenzene purity 98.0% or more), 27.00 g of solid sulfur (manufactured by Kanto Chemical Co., Ltd., sulfur (powder)), 4,4'-dithiobisphenyl 2.0 g of formic acid (manufactured by Wako Pure Chemical Industries, Ltd., 4,4'-dithiobisbenzoic acid, Technical Grade) was heated at 180° C., and these were dissolved and mixed under nitrogen gas. Next, the temperature was raised to 220° C., and the pressure was reduced to an absolute pressure of 26.6 kPa. For the obtained molten mixture, the temperature and pressure were changed stepwise so that the absolute pressure at 320° C. became 133 Pa, and melt polymerization was performed for 8 hours. After completion of the reaction, 200 g of NMP was added, heated and stirred at 220° C., and the obtained dissolved matter was filtered. NMP320g was added to the dissolved substance after filtration, and filter cake washing and filt...

Synthetic example 2

[0155] (Synthesis Example 2: Synthesis of PPS-2)

[0156] PPS resin (PPS-2) was obtained in the same manner as in Synthesis Example 1 except that "2-iodoaniline (manufactured by Tokyo Chemical Industry Co., Ltd.)" was used instead of "4,4'-dithiobisbenzoic acid". 91g.

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Abstract

The present invention relates to a polyarylene sulfide resin composition, a molded article thereof, and a surface mount electronic component. Specifically, a polyarylene sulfide resin composition for surface-mounting electronic components, a molded article using the resin composition, and an electronic component including the molded article are provided, wherein the polyarylene sulfide resin composition for surface-mounted electronic components contains a polyarylene sulfide resin; and at least one component selected from the group consisting of inorganic fillers, thermoplastic resins other than polyarylene sulfide resins, elastomers, and crosslinkable resins having two or more crosslinkable functional groups. The polyarylene sulfide resin can be obtained by a method of allowing a diiodo aromatic compound, elemental sulfur, and a polymerization inhibitor in a molten mixture containing the diiodo aromatic compound, the elemental sulfur, and the polymerization inhibitor.

Description

[0001] This application is a divisional application of an application with a filing date of August 28, 2014, an application number of 201480053300.4, and an invention title of "polyarylene sulfide resin composition and its molded products, and surface-mounted electronic components". technical field [0002] The present invention relates to a polyarylene sulfide resin composition, its molded article, and a surface mount electronic component. Background technique [0003] In recent years, in the field of electrical / electronics industry, along with the miniaturization of products and the improvement of productivity, the method of mounting resin-based electronic components on printed circuit boards has moved to the method called surface mount (hereinafter sometimes referred to as "surface mount"). SMT method") surface mount method transition. The technology of mounting electronic components on substrates by using this SMT method currently generally uses tin-lead eutectic solder ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02C08L77/06C08K7/14C08G75/0263C08G75/02
CPCC08L77/06H01L23/293H01L2924/0002C08K7/14C08L81/02H01L2924/00C08G75/02
Inventor 山田启介渡边创桧森俊男
Owner DIC CORPORATION
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