2results about How to "Improve load characteristics" patented technology

The invention relates to a micromechanical component for a sensor device, having a first seismic mass (30a), wherein the first seismic mass, which is displaceable from its first rest position in a first direction (44) over a first limit path along a first axis, mechanically contacts a first stop structure, and having a second seismic mass (30b), which is displaceable from its second rest position at least along a second axis, wherein the second axis is parallel to or lies on the first axis, wherein a second stop surface (50b) of the second seismic mass, which is displaceable from its second rest position in a second direction (46) which is oriented opposite to the first direction along the second axis, mechanically contacts a first stop surface (50a) of the first seismic mass which is attached to the first stop structure. The invention also relates to a method for producing a micromechanical component for a sensor device.