Fan-out module high voltage packaging process, structure and equipment

Abstract

The invention discloses a fan-out module high-voltage packaging process, equipment and structure, wherein the fan-out module high-voltage packaging process includes the following steps: along the stacking direction of the package body, a temporary bonding layer is flatly laid on the top surface of the base, and the Place a plurality of modules in the gap between the top surface of the temporary bonding layer, inject molding from the top of the modules to form an injection molding layer surrounding the modules, and make the bottom surface of the injection molding layer bond with the temporary bonding layer; Direction, uniformly apply high-pressure gas to the top surface of the uncured injection molding layer or uniformly pressurize through the pressing plate. Apply pressure to the top surface of the uncured injection molding layer, such as by high-pressure gas or uniform pressure through the pressure plate, so that, with the assistance of pressure, the molten injection molding material flows to the void and low stress area, so that the overall distribution of the injection molding layer is uniform, so that Effectively avoid warpage and internal stress caused by differences in local structure and thermal expansion coefficient.

Description

technical field [0001] The present invention relates to the field of packaging technology, and more specifically, to a fan-out module high-voltage packaging process, a fan-out module high-voltage packaging structure, and a fan-out module high-voltage packaging equipment. Background technique [0002] With the trend of miniaturization and integration of electronic products, the high density of microelectronic packaging technology has gradually become the mainstream in the new generation of electronic products. In order to adapt to the development of the new generation of electronic products, especially the development of mobile phones, notebooks and other products, modules are developing in the direction of higher density, faster speed, smaller size and lower cost. The emergence of Fan-out Panel Level Package (FOPLP), as an upgraded technology of Fan-out Wafer Level Package (FOWLP), has a broader development prospect. Compared with traditional wire-bonded modules, fan-out pa...

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Problems solved by technology

[0005] In view of this, the first purpose of the present invention is to provide a fan-out module high-voltage packaging process, which can effectively solve the problem of warping in the chip packaging process. The second aspect of the present invention The first purpose is to provide a fan-out module high-voltage packaging structure, and the third purpose of the present invention is to provide a fan-out module high-voltage packaging equipment

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