Polishing solution circulation purification processing device

Abstract

The invention discloses a polishing solution circulation purification processing device. The polishing solution circulation purification processing unit comprises a box body, a polishing solution storage tank is arranged at the bottom of one side of the box body, a polishing solution separating device is arranged at the top of the polishing solution storage tank, the polishing solution storage tank is internally provided with a polishing solution stirring unit, a polishing solution proportion stirring unit is arranged at the bottom of the other side of the box body, and a polishing solution sediment secondary separation unit is arranged on the upper part of the polishing solution proportion stirring unit; the polishing solution separating device comprises a rotary barrel, a rotary barrel driving motor and a lifting mechanism; and the rotary barrel comprises an inner barrel and an outer barrel. Three-level layering is generated on a waste polishing solution through matching of the polishing solution separating device and the polishing solution storage tank, the polishing solution rotating at the high speed is separated according to the abrasive particle density in the polishing solution, secondary separation can be conducted on polishing solutions which do not coincide with the requirements, abrasive particles coinciding with the using requirements are directly output, polishedand machined, and the separation efficiency is greatly improved.

Description

technical field [0001] The invention relates to a polishing liquid processing device, in particular to a polishing liquid circulating purification processing device. Background technique [0002] At present, with the development of science and technology and the upgrading of the industry chain, the processing standards in various fields of society continue to rise, and the demand for smooth or ultra-smooth surface components is increasing. In the standard of the optical field, the surface accuracy of the complex curved surface element is required to be within a few tenths of a wavelength, and its surface roughness is required to be below 5 nanometers. It is an important research direction to control the factors that affect the polishing quality in each link during the polishing process, so as to improve the precision of the polished workpiece surface and reduce the surface roughness. However, during the polishing process, the core material polishing liquid requires a large ...

AI Technical Summary

Problems solved by technology

If the polishing liquid is not replaced in time, the material particles on the surface of the workpiece mixed in the polishing liquid will enter the polishing particles and enter the micro-cutting scratches on the surface of the workpiece, thereby weakening the cutting effect of the polishing particles and reducing the processing efficiency. Scratches on the polishing surface or uneven polishing removal degree caused by agglomeration or uneven dispersion of polishing particles

Although this kind of phenomenon may be eliminated in the subsequent polishing process, it will greatly increase the polishing time and the amount of polishing liquid used, which will increase the production cost of the product and reduce the overall surface quality

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