Full-automatic vacuum packaging device for SMD elements

Abstract

The invention discloses a full-automatic vacuum packaging device for SMD elements. The full-automatic vacuum packaging device for the SMD elements comprises a device main body, wherein a workbench isfixedly installed on the upper surface of the device main body; a feeding mechanism is fixedly installed at the middle position, close to the rear end, of the upper surface of the workbench; two parallel carrier plates are fixedly installed at the positions, close to the front end, of the upper surface of the workbench; and a material taking mechanism is fixedly installed on the upper surface of the carrier plates. According to the full-automatic vacuum packaging device for the SMD elements, the feeding mechanism is obliquely designedon the workbench with the oblique angle being45 degrees, sothat the SMD elements freely fall in a material pipe by utilizing the obliquity, and the discharging efficiency is improved; each SMD element can be accurately picked by adopting the material taking mechanism and prevented from being omitted during packaging, the picking speed of the material taking mechanism is high, and the packaging efficiency of the device can be improved; and a sealing mechanism is arranged, the sealing mechanism adopts an extrusion mode to package and evacuate, the process is simple, and the packaging time is shortened.

Description

technical field [0001] The invention relates to the technical field of packaging devices, in particular to a fully automatic vacuum packaging device for SMD components. Background technique [0002] SMD component, which is the abbreviation of Surface Mounted Devices, means: surface mount device, which is a kind of SMT component. In the initial stage of electronic circuit board production, via assembly is completely done manually. When the first automated machines came out, they could place some simple leaded components, but complex components still required manual placement for reflow soldering. Surface mount components mainly include rectangular chip components, cylindrical chip components, composite chip components, and special-shaped chip components; SMD components need to be packaged during production, and packaging devices are required for packaging. [0003] The packaging device is a kind of machine that packs the product, which plays the role of protection and beaut...

AI Technical Summary

Problems solved by technology

[0003] The packaging device is a kind of machine that packs the product, which plays the role of protection and beauty; the packaging machine is mainly divided into two aspects: the overall production packaging of the assembly line and the peripheral packaging equipment of the product, and the overall production packaging of the assembly line, which is used in food, medicine , Daily chemicals, hardware, lighting, sealing machines, coding, the existing SMD component packaging devices generally rely on manual experience in many processes during packaging, it is difficult to effectively prevent the packaging of defective SMD components, and in assembly line operations, Subsequent operations can only be carried out after the glue bonded by the belt is completely cured, which is quite inefficient and brings a lot of inconvenience to the production and packaging of the workshop.

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