Processing method for blowing type soaking plate with capillary structure
A capillary structure and processing method technology, applied in the field of heat dissipation, can solve the problems of filler deformation, affecting the formation of capillary structure, breaking, etc., to achieve the effect of avoiding deformation and improving heat dissipation effect
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[0034] Example one
[0035] See Figure 1 to Figure 4 , The first embodiment of the present invention provides a method for processing an inflatable soaking plate with a capillary structure, which specifically includes the following steps:
[0036] Step S1: Prepare materials and prepare two substrates 1. In this embodiment, both substrates 1 are aluminum plates, and the model of the aluminum plates is 3003.
[0037] Step S2: printing and covering, cleaning and roughening one of the substrates 1, and printing the anti-rolling agent 2 on the roughened surface of the substrate 1 according to the pattern of the cavity or the flow path required by the process. The anti-rolling agent 2 is cured on the substrate 1 after drying, and then another substrate 1 is covered on the substrate 1 printed with the anti-rolling agent 2 so that the anti-rolling agent 2 is located between the two substrates 1.
[0038] In this embodiment, the rolling resist 2 is graphite emulsion or boron nitride emulsion...
Example Embodiment
[0056] Example two
[0057] See Figure 5 The difference between the processing method of the inflatable heat spreading plate with capillary structure provided in the second embodiment of the present invention and the processing method of the inflatable heat spreading plate with capillary structure in the first embodiment is that: in this embodiment, A heat-conducting plate 31 is provided on the outer surface of at least one of the two substrates 1, and the heat-conducting plate 31 and the substrate 1 to which it is connected together form a copper-aluminum composite plate 3. The thermal conductivity of the thermal conductive plate 31 is higher than the thermal conductivity of the substrate 1. Understandably, the material of the heat conducting plate 31 may be copper or copper alloy or the like. In this embodiment, the coverage rate of the heat conductive plate 31 is 3 to 30%. It should be noted that the coverage rate refers to the ratio of the thickness of the thermal conducti...
Example Embodiment
[0062] Example three
[0063] The difference between the processing method of the inflatable heat spreading plate with capillary structure provided in the third embodiment of the present invention and the processing method of the inflatable heat spreading plate with capillary structure in the second embodiment is that: in this embodiment, The two substrates 1 and the heat-conducting plate 31 are simultaneously hot-rolled. After one of the substrates 1 is cleaned and roughened, the anti-rolling agent 2 is printed on the roughened surface of the substrate 1 and riveted with the other substrate 1 and the heat-conducting plate 31 to conduct heat The plate 31 is on the outside. When processing, it is only necessary to provide the heat conducting plate 31 and the two substrates 1 to be rolled at the same time, and to perform inflation between the two substrates 1.
[0064] In this embodiment, before hot rolling, the thickness of one substrate 1 is 1.5 to 3.0 mm, the thickness of the oth...
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