A cascaded phase change plate heat storage and heat exchange integrated device
A phase change heat storage and phase change technology, which is applied in heat storage equipment, indirect heat exchangers, heat exchanger types, etc., can solve the problems of low heat transfer efficiency of phase change materials, improve the equivalent thermal conductivity, overcome The effect of low thermal conductivity and fast heat transfer rate
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2021-02-19
Smart Images

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Abstract
Description
technical field
[0001] The invention relates to the field of heat storage and heat release equipment, in particular to a cascaded phase change plate type integrated heat storage and heat exchange device. Background technique
[0002] The fossil energy crisis and environmental protection urgently require the improvement of energy utilization efficiency and vigorous development and utilization of renewable green new energy. Among renewable new energy sources, the utilization of solar energy is favored, and remarkable results have been achieved in the application of solar photovoltaics, but the application of solar thermal energy is almost limited to solar water heaters, and the application of solar heating and solar drying is just in its infancy . For my country's severe cold, cold, hot summer and cold winter regions, heating in winter needs to consume a lot of energy every year. If the heating in winter can make full use of solar heat, it will significantly reduce the consum...
Examples
Embodiment 1
[0036]A cascaded phase change plate heat storage and heat exchange integrated device, including a phase change heat storage layer, a cold fluid horizontal channel layer is arranged on the phase change heat storage layer, a hot fluid horizontal channel layer is arranged under the phase change heat storage layer, and the hot fluid horizontal channel layer is arranged under the phase change heat storage layer. A cold fluid horizontal channel layer is arranged under the channel layer to form a set of cold fluid horizontal channel layer-phase change heat storage layer-hot fluid horizontal channel layer-cold fluid horizontal channel layer-phase change heat storage layer-hot fluid from top to bottom The basic structure of the horizontal channel layer; the phase change thermal storage layer, the cold fluid horizontal channel layer, and the hot fluid horizontal channel layer are separated by metal plates; the phase change thermal storage layer includes a phase change thermal storage laye...
Embodiment 2
[0046] A cascaded phase change plate heat storage and heat exchange integrated device, including a phase change heat storage layer, a cold fluid horizontal channel layer is arranged on the phase change heat storage layer, a hot fluid horizontal channel layer is arranged under the phase change heat storage layer, and the hot fluid horizontal channel layer is arranged under the phase change heat storage layer. A cold fluid horizontal channel layer is arranged under the channel layer to form a set of cold fluid horizontal channel layer-phase change heat storage layer-hot fluid horizontal channel layer-cold fluid horizontal channel layer-phase change heat storage layer-hot fluid from top to bottom The basic structure of the horizontal channel layer; the phase change thermal storage layer, the cold fluid horizontal channel layer, and the hot fluid horizontal channel layer are separated by metal plates; the phase change thermal storage layer includes a phase change thermal storage lay...
Embodiment 3
[0054] Compared with Example 1, the main difference between Example 3 is that each layer of phase change heat storage material is individually packaged in a sealed box, and the cold and hot fluid pipelines do not pass through the sealed box of the phase change heat storage layer. Others are consistent with Example 1. , Replacement of the phase change heat storage layer in the device can directly replace the phase change heat storage layer of each layer of the overall package, more flexible change of the heat storage capacity of the device, easy disassembly and cleaning, and easier assembly and use of the device.