Vapor deposition cooling device
A vapor deposition and cooling device technology, applied in ion implantation plating, metal material coating process, coating, etc., can solve the problems of difficult heat dissipation and low heat dissipation efficiency of the substrate, and achieve convenient operation, high heat dissipation efficiency, and realization of The effect of cooling
Pending Publication Date: 2019-10-29
紫石能源有限公司
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] The purpose of the present invention is to solve the problem of the prior art that it is difficult to dissipate heat and the heat dissipation efficiency is low for the substrate that is continuously moving in a vacuum environment in the online deposition process
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0029] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0030] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.
[0031] figure 1 A stru...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the technical field of vapor deposition, and discloses a vapor deposition cooling device. The vapor deposition cooling device comprises a cooling liquid injecting mechanism and a lifting device; the cooling liquid injecting mechanism comprises a liquid injecting part and a liquid inlet pipe, wherein the liquid injecting part is arranged in a vacuum deposition area, and when a carrier stays in the vacuum deposition area, the liquid injecting part moves up and down under the driving by the lifting device and is inserted into a cooling liquid containing area inside the carrier to inject cooling liquid; and the liquid inlet pipe extends into the vacuum deposition area from the outside and communicates with the liquid injecting part so as to inject the cooling liquid into the cooling liquid containing area from the outside through the liquid injecting part. The vapor deposition cooling device can realize cooling and heat dissipation of a substrate of an on-line vapor deposition device, and is simple in structure, convenient to operate and high in heat dissipation efficiency.
Description
technical field [0001] The invention relates to the technical field of vapor deposition, in particular to a vapor deposition cooling device. Background technique [0002] Physical vapor deposition (PVD) refers to the use of physical processes to achieve material transfer, the process of transferring atoms or molecules from the source to the surface of the substrate. , corrosion resistance, etc.) particles are sprayed on the matrix with lower performance, so that the matrix has better performance, and are often used in the fields of semiconductors and solar energy. [0003] The commonly used methods of physical vapor deposition are: vacuum evaporation, sputtering and ion plating. The above vapor deposition methods all use sputtering cathodes or evaporation sources to deposit thin films on substrates in a vacuum environment, including two deposition methods: batch deposition (Batch PVD) and online deposition (in line PVD) . The batch deposition process is that the carrier p...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): C23C14/56C23C14/50
CPCC23C14/56C23C14/50
Inventor 蒲春
Owner 紫石能源有限公司