Preparation method for high-performance heat conductive copper powder

A high-performance, copper powder technology, applied in the field of metal powder, can solve the problems of high production cost, low powder yield, difficult control of powder porosity, etc., achieve small particle size range, increase viscosity, and improve comprehensive utilization rate Effect

Active Publication Date: 2019-11-01
铜陵鑫佳粉体新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production, there are defects such as low powder yield, high production cost, and difficult control of powder porosity. Therefore, we design a preparation method of high-performance thermally conductive copper powder

Method used

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Examples

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Effect test

preparation example Construction

[0016] The invention discloses a method for preparing high-performance thermally conductive copper powder. The specific preparation steps are as follows:

[0017] (1) The copper ingot is melted, put the copper ingot into the melting furnace, the melting temperature is controlled at a temperature of 1150°C-1250°C, and the copper ingot is melted under electromagnetic stirring;

[0018] (2) Use an air compressor to oxidize the melted copper liquid with air, and the oxidation time is 26-30 minutes, which can increase the viscosity of the copper liquid;

[0019] (3) Use the atomization method to put the copper liquid under the high pressure condition above 20Mpa, and spray the copper powder from the annular nozzle;

[0020] (4) After the atomized copper powder is dried, the dried copper powder is strictly classified. The particle size range of the copper powder is 60 mesh-80 mesh, 80 mesh-100 mesh, 100 mesh-150 mesh, 150 mesh -200 mesh, 200 mesh-300 mesh, 250-300 mesh;

[0021] (...

Embodiment 1

[0026] The invention discloses a method for preparing high-performance thermally conductive copper powder. The specific preparation steps are as follows:

[0027] (1) The copper ingot is melted, put the copper ingot into the melting furnace, the melting temperature is controlled at 1150°C, and the copper ingot is melted under electromagnetic stirring;

[0028] (2) Use an air compressor to oxidize the melted copper liquid with air, and the oxidation time is 26 minutes, which can increase the viscosity of the copper liquid;

[0029] (3) Use the atomization method to put the copper liquid under the high pressure condition above 20Mpa, and spray the copper powder from the annular nozzle;

[0030] (4) After the atomized copper powder is dried, the dried copper powder is strictly classified. The particle size range of the copper powder is 60 mesh-80 mesh, 80 mesh-100 mesh, 100 mesh-150 mesh, 150 mesh -200 mesh, 200 mesh-300 mesh, 250-300 mesh;

[0031] (5) The atomized copper powd...

Embodiment 2

[0036] The invention discloses a method for preparing high-performance thermally conductive copper powder. The specific preparation steps are as follows:

[0037] (1) The copper ingot is melted, put the copper ingot into the melting furnace, the melting temperature is controlled at 1200°C, and the copper ingot is melted under electromagnetic stirring;

[0038] (2) Use an air compressor to oxidize the melted copper liquid with air, and the oxidation time is 28 minutes, which can increase the viscosity of the copper liquid;

[0039] (3) Use the atomization method to put the copper liquid under the high pressure condition above 20Mpa, and spray the copper powder from the annular nozzle;

[0040] (4) After the atomized copper powder is dried, the dried copper powder is strictly classified. The particle size range of the copper powder is 60 mesh-80 mesh, 80 mesh-100 mesh, 100 mesh-150 mesh, 150 mesh -200 mesh, 200 mesh-300 mesh, 250-300 mesh;

[0041] (5) The atomized copper powd...

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PUM

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Abstract

The invention discloses a preparation method for high-performance heat conductive copper powder. The preparation method specifically comprises the steps of melting a copper ingot; performing air blowing oxidation on molten copper liquid by using an air compressor; adopting an atomization method to place the copper liquid in a condition of a high pressure of 20 Mpa or above and spray copper powderfrom an annular nozzle; drying the atomized copper powder, and strictly grading the dried copper powder; carrying out oxygen roasting treatment on the atomized copper powder; then carrying out reduction treatment on the powder of all particle size ranges by using a reducing gas at a temperature of 600-800 DEG C; and finally, respectively crushing the oxidized and reduced powder in all particle size ranges to obtain the heat dissipation copper powder with various particle sizes required by the heat conduction industry at the present stage and with controllable porosity and capillary gap size. By means of the preparation method, the viscosity of the copper liquid can be improved through blowing air for oxidation in the molten copper liquid, so that the comprehensive utilization rate of copper powder products obtained by atomizing the copper liquid is improved, and the production cost is greatly saved.

Description

technical field [0001] The invention relates to the technical field of metal powders, in particular to a preparation method of high-performance heat-conducting copper powder. Background technique [0002] In recent years, with the development of lightweight and high-performance electronic products, the heat dissipation of products has increased more and more, while the market price has continued to decrease, and the requirements for heat dissipation of electronic products have also become higher and higher. The redesign of the heat pipe heat dissipation copper powder not only improves the heat dissipation efficiency of the heat pipe, but also reduces the production cost of the heat conduction copper powder. [0003] The existing heat pipe structure is that the inner and outer circumferences of the pipe wall are concentric, and the thickness of the upper and lower parts of the pipe wall is uniform. After adding copper powder to the pipe, after sintering, a capillary porous ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08B22F1/00
CPCB22F9/082B22F1/145
Inventor 胡柏明
Owner 铜陵鑫佳粉体新材料科技有限公司
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