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High-frequency high-speed flexible circuit board manufacturing process

A flexible circuit board and manufacturing process technology, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve problems such as poor bending property and copper skin fracture, and achieve good structural stability, strong bonding force, The effect of controllable machining accuracy

Active Publication Date: 2020-11-06
台山市精诚达电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Advantages: The signal is effectively protected, and the transmission of 5G high-frequency signals is stable; Disadvantages: The bending property is poor, and the copper skin will break after bending the product many times

Method used

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  • High-frequency high-speed flexible circuit board manufacturing process
  • High-frequency high-speed flexible circuit board manufacturing process
  • High-frequency high-speed flexible circuit board manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Please refer to figure 1 , Embodiment 1 of the present invention is: a high-frequency high-speed flexible circuit board manufacturing process, including the preparation process of the first stacked structure, and the preparation of the first stacked structure includes the following steps,

[0052] Copper sputtering I, the first copper layer is sputtered on the outer copper-free surface of the first substrate;

[0053] Dry film exposure and development Ⅰ, dry film, exposure and development are carried out sequentially on the first copper layer. After development, the dry film in the bending area of ​​the first copper layer is retained, and the dry film in the non-bending area is removed;

[0054] Copper layer thickening I, thickening the copper layer on the non-bending area of ​​the first copper layer, optionally, performing copper layer thickening treatment on the non-bending area of ​​the first copper layer by using an electroplating copper process;

[0055] Removing ...

Embodiment 2

[0069] Please refer to Figure 2 to Figure 9 , the second embodiment of the present invention is: high-frequency high-speed flexible circuit board manufacturing process,

[0070] Step 1: Prepare the first base material 1 and the second base material 2, the first base material 1 has no copper layer on both sides, and the second base material 2 has no copper layer on both sides. Such as figure 2 shown.

[0071] Step 2: Sputtering an inner copper layer 3 with a thickness of 12 microns on the front side of the first base material 1 and sputtering a first copper layer 4 with a thickness of 4 microns on the back side of the first base material 1; The front side of the material 2 is sputtered with a second copper layer 5 with a thickness of 4 microns, and the reverse side of the second base material 2 is not plated with copper. Finally, the first substrate 1 and the second substrate 2 are cut. Such as image 3 shown.

[0072] Step 3: According to the design requirements, the i...

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Abstract

The invention discloses a high-frequency and high-speed flexible circuit board manufacturing technology, which includes a preparation process of a first stack structure. The preparation of the first stack structure includes the following steps: copper sputtering I: coating an outer copper-free surface of a first base material with a first copper layer by sputtering; dry film exposure and development I: pasting a dry film onto the first copper layer and exposing and developing the dry film in turn, wherein the dry film in the bending area of the first copper layer is retained and the dry film in the non-bending area is removed after development; copper layer thickening I: performing copper layer thickening in the non-bending area of the first copper layer; and film removal I: removing the dry film in the bending area of the first copper layer. The first copper layer formed by sputtering has a large binding force with the first base material and good structural stability. The bending area of the first copper layer formed by sputtering can be made thinner and can be bent multiple times without fracture, and thus, the flexibility and bending resistance of the circuit board are ensured.In the whole processing process, the processing accuracy is controllable, and the product consistency is good.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a high-frequency and high-speed flexible circuit board manufacturing process. Background technique [0002] During the transmission process of 5G high-frequency and high-speed signals, the anti-interference protection of signal lines is particularly important. At present, the most effective stacking design is to shield and protect the upper and lower layers of the transmission line, so as to achieve stable transmission of 5G high-frequency and high-speed signals. [0003] For the setting of the shielding layer, two solutions are generally adopted in the industry at present: Option 1, the copper skin is reserved on the upper and lower reference layers, similar to the coaxial cable stacking structure. Advantages: The signal is effectively protected, and the transmission of 5G high-frequency signals is stable; Disadvantages: The bendability is poor, and the copper skin will b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/02H05K3/06H05K3/24H05K3/46
CPCH05K3/022H05K3/06H05K3/24H05K3/4644
Inventor 刘振华苏章泗韩秀川
Owner 台山市精诚达电路有限公司