Sapphire slice free abrasive grinding device

Abstract

The present invention relates to the technical field of grinding equipment, and provides a sapphire slice free abrasive grinding device. The sapphire slice free abrasive grinding device includes: a grinding disc, the upper surface of which is provided with a plurality of annular grooves with different diameters; Each of the annular grooves is connected with a drain hole, one end of the drain hole is connected to the annular groove, and the other end is connected to the peripheral surface of the grinding disc; a stop ring, the stop ring can be connected with One end of the liquid discharge hole is in contact or non-contact; a liquid supply pipe, the liquid supply pipe is arranged above the grinding disc, and a plurality of liquid supply holes are arranged at intervals on the liquid supply pipe. In the present invention, an annular groove is arranged on the upper surface of the grinding disc, and the grinding liquid is stored in the annular groove to avoid the loss of the grinding liquid; after the grinding liquid is discharged through the liquid discharge hole, the grinding liquid is supplied to the grinding disc through the liquid supply pipe, so that The grinding fluid on the surface of the grinding disc can be quickly renewed, improving the processing quality of the grinding disc.

Description

Technical field[0001]The invention relates to the technical field of grinding equipment, in particular to a sapphire slice free abrasive grinding device.Background technique[0002]Sapphire single crystal has the characteristics of high hardness, good light transmission, high wear resistance, good chemical stability, thermal conductivity, electromagnetic insulation, and excellent mechanical properties. It is widely used as a window and sapphire wafer material in the defense industry Cutting-edge technology research and civilian fields.[0003]Sapphire is brittle and is a typical difficult-to-process material. At present, the preparation of sapphire slices mainly includes slicing, leveling and polishing. In the leveling process, free abrasive grinding is used to remove the cut marks generated during the wire cutting process and obtain a relatively flat surface, which provides a good foundation for subsequent polishing.[0004]In the free abrasive grinding process, the relative speed and pr...

AI Technical Summary

Problems solved by technology

Under high-speed grinding, the grinding liquid is more likely to be thrown out of the grinding disc, thereby reducing the distribution of abrasives in the grinding disc, and due to the inertial effect, the distribution of abrasives along the radial direction is more uneven, resulting in waste of abrasives, reduced processing efficiency and processed samples. surface topography is worse

Under higher grinding pressure, less abrasive penetrates into the gap between the sapphire slice and the grinding disc. At the same time, the different materials of the grinding disc will lead to different embedding effects of the abrasive, which will affect the material removal rate of the process and cause the grinding disc to wear poorly. uniform

Images