Novel high-temperature sintering furnace

Abstract

The invention relates to a novel high-temperature sintering furnace, and belongs to the technical field of kiln facilities. The novel high-temperature sintering furnace comprises a furnace body, wherein a hearth is arranged in the center of the furnace body; a silicon molybdenum rod left heating element is distributed at the position corresponding to the left side of the hearth from the front endof the hearth to the back end; and a silicon molybdenum rod right heating element is distributed at the position corresponding to the right side of the hearth from the front end of the hearth to the back end. The novel high-temperature sintering furnace is characterized in that a left brick filling mechanism holding chamber is formed at the position, corresponding to the silicon molybdenum rod left heating element, on furnace top bricks; a right brick filling mechanism holding chamber is formed at the position, corresponding to the silicon molybdenum rod right heating element, on furnace top bricks; a left brick filling mechanism is arranged in the left brick filling mechanism holding chamber; a right brick filling mechanism is arranged in the right brick filling mechanism holding chamber;the upper end of the silicon molybdenum rod left heating element is matched with the left brick filling mechanism via insertion; and the upper end of the silicon molybdenum rod right heating elementis matched with the right brick filling mechanism via insertion. The engineering cost for replacing silicon molybdenum rods is reduced, the sintering efficiency is improved, a sealing effect of the top part of the hearth cannot be influenced, and the convenience in replacement is realized.

Description

technical field

[0001] The invention belongs to the technical field of kiln facilities, and in particular relates to a novel high-temperature sintering furnace. Background technique

[0002] As known in the industry, no matter it is used for sintering various electronic components, or for sintering various common and special and high-end electronic powder materials, the structure of the furnace body and the heating components and their setting methods are systemic. its very important component. This can be confirmed by the "hearth structure of battery material sintering furnace" recommended by Chinese patent CN105783517A and the "hearth heating device of MIN sintering furnace" provided by CN204934610U.

[0003] Furthermore, as known in the industry, the sintering temperature of some electronic materials such as alumina substrates, aluminum nitride substrates, ceramic substrates, etc. is relatively high, and is around 1500-1600 ° C, so if you use traditional heating wires an...

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