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Vertical Interconnection Framework

A frame and frame body technology, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as low integration, complex assembly, poor shielding performance, etc., to improve integration, reduce assembly difficulty, Good shielding effect

Active Publication Date: 2021-09-17
LEIHUA ELECTRONICS TECH RES INST AVIATION IND OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] By providing a vertical interconnection frame in which the frame body is made of an insulating flexible dielectric material and has a metal layer on the outer surface of the frame body, the shortcomings of the existing vertical interconnection frame such as complex assembly, low integration, and poor shielding performance are solved, and further Facilitates miniaturization of tiled components

Method used

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  • Vertical Interconnection Framework
  • Vertical Interconnection Framework
  • Vertical Interconnection Framework

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Embodiment Construction

[0032] refer to Figure 1-Figure 3 ,in figure 1 shows a vertical interconnection frame 1 according to an embodiment of the invention; figure 2 shows a cross-section of a vertical interconnected frame 1 according to an embodiment of the invention; image 3 The vertical interconnection structure of the vertical interconnection frame 1 and the microwave boards 2 and 3 according to the embodiment of the present invention is schematically shown.

[0033] The vertical interconnection frame 1 includes a frame body 11, a through hole 12 and a metal layer 13 on the outer surface of the frame body, wherein the frame body 1 is made of an insulating flexible dielectric material; the through hole is used to accommodate hair Button 4, when the vertical interconnection frame 1 is placed between the vertically stacked microwave boards 2, 3, the signal between the microwave boards 2, 3 is realized through the fur button 4 passing through the vertical interconnection frame 1 Vertical transm...

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Abstract

The vertical interconnected frame of the present invention includes a frame body, a through hole and a metal layer on the outer surface of the frame body, wherein the frame body is made of an insulating flexible dielectric material; the through hole is used to accommodate buttons, When the vertical interconnection frame is placed between vertically stacked microwave boards, the vertical transmission of signals between the microwave boards is realized through the fur buttons passing through the vertical interconnection frame. The vertical interconnection frame of the present invention improves integration, realizes miniaturization, reduces assembly procedures, improves production efficiency, and is lightweight, low in cost, and has good shielding and isolation effects.

Description

technical field [0001] The invention relates to the technical field of microwave electronic products, in particular to a vertical interconnection frame for flexible vertical interconnection of tile components. Background technique [0002] Transmitter-Receiver (TR) components are the core components of light-weight and low-profile active phased array antennas. In order to meet the requirements of small, light, low-profile and high-efficiency TR components, tile-type components can effectively reduce the active phase array antenna. The volume and weight of the array antenna. The high-density packaging technology of tile-type modules mainly includes microwave multi-chip module technology and three-dimensional stacked packaging technology. Small module size. However, in the design process of the three-dimensional stacked package structure, the vertical transmission of radio frequency signals and the isolation of the cavity have always been the focus of research. [0003] Ver...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/538H01L23/552
CPCH01L23/5384H01L23/5386H01L23/552
Inventor 匡婷金涛代海洋
Owner LEIHUA ELECTRONICS TECH RES INST AVIATION IND OF CHINA