Unlock instant, AI-driven research and patent intelligence for your innovation.

Collapsing-free UV-moisture double-curing adhesive, and preparation method thereof

A dual-curing, UV-technology, applied in the direction of adhesives, non-polymer organic compound adhesives, non-polymer adhesive additives, etc., can solve the difficulty of polluting pad dispensing process and adverse effects on product performance. Achieve the effects of strong adhesion, fast curing and low energy consumption

Inactive Publication Date: 2019-11-12
上海本诺电子材料有限公司
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the most widely used dispensing process at present, the regular size and shape of the glue dots are required to ensure the stability of performance. Therefore, there are high requirements for the coating height and collapse resistance of the glue. At least there is a certain collapse phenomenon, and the contamination of the pad also increases the difficulty of the dispensing process and adversely affects product performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Collapsing-free UV-moisture double-curing adhesive, and preparation method thereof
  • Collapsing-free UV-moisture double-curing adhesive, and preparation method thereof
  • Collapsing-free UV-moisture double-curing adhesive, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] 1. The composition of the UV-moisture dual-curing adhesive in this embodiment is shown in Table 1.

[0023] The composition of UV-moisture dual curing adhesive in Table 1 embodiment 1

[0024]

[0025] 2. The preparation method of curing glue is:

[0026] (1) Get the acrylic acid diluent of formula quantity and photoinitiator and mix, and heating makes mixture dissolve evenly;

[0027] (2) Mix the above mixture with the formulated amount of isocyanate, acrylic resin, filler, polymerization inhibitor and auxiliary agent, and grind it evenly on a three-roll machine to obtain a UV-moisture dual-curing adhesive.

Embodiment 2

[0029] 1. The composition of the UV-moisture dual-curing adhesive in this embodiment is shown in Table 2.

[0030] The composition of UV-moisture double curing adhesive in table 2 embodiment 2

[0031]

[0032]

[0033] The preparation method of cured glue is the same as in Example 1.

Embodiment 3

[0035] 1. The composition of the UV-moisture dual-curing adhesive in this embodiment is shown in Table 3.

[0036] The composition of UV-moisture double curing glue in table 3 embodiment 3

[0037]

[0038] The preparation method of cured glue is the same as in Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of curing adhesive, and more specifically relates to a collapsing-free UV-moisture double-curing adhesive, and a preparation method thereof. The collapsing-free UV-moisture double-curing adhesive comprises following components, by weight, 20 to 40 parts of an isocyanate, 10 to 40 parts of acrylic resin, 20 to 50 parts of a acrylic acid diluent, 2 to 4 parts of a photoinitiator, 5 to 10 parts of a filling material, 1 to 3 parts of a polymerization inhibitor, and 1 to 3 parts of an auxiliary agent. According to the collapsing-free UV-moisture double-curing adhesive, UV curing and moisture curing are combined, so that adhesive curing can be realized in shadows or at dark environment, UV curing adhesive application range is widened effectively, complete curing of the collapsing-free UV-moisture double-curing adhesive on complex circuit boards can be realized, and collapsing in coating technology can be avoided.

Description

technical field [0001] The invention belongs to the technical field of curing adhesives, and in particular relates to a non-collapse UV-moisture double curing adhesive and a preparation method thereof. Background technique [0002] Ultraviolet (UV) curing technology is an efficient and fast curing technology, which is widely used in the field of adhesives because of its low energy consumption, no pollution, and fast curing. But because it must have light conditions, it greatly limits the application range of the adhesive. [0003] With the advancement of science and technology, the design structure of PCB is becoming more and more complex, the volume of components is gradually shrinking, and the requirements for product reliability and assembly process are more stringent. In electronic assembly, in order to prevent components from shifting or falling off due to vibration and impact, it is necessary to fix them with adhesives. UV-moisture dual-curing adhesives have a wide ra...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J4/02C09J4/06C09J11/04C09J11/06
CPCC09J4/06C09J11/04C09J11/06
Inventor 郭晨婷
Owner 上海本诺电子材料有限公司