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A kind of tungsten-plated diamond particles, tungsten-plating method, its application as copper-based reinforcing phase and obtained diamond/copper composite material

A technology of diamond particles and reinforcing phase, applied in metal material coating process, sputtering coating, vacuum evaporation coating and other directions, can solve the problems of high interface thermal resistance and poor bonding between diamond particles and matrix.

Active Publication Date: 2020-10-27
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of poor bonding between diamond particles and the matrix and high interface thermal resistance, and provide a tungsten-plated diamond particle, a tungsten plating method, its application as a copper-based reinforcing phase, and the obtained diamond / copper composite material

Method used

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  • A kind of tungsten-plated diamond particles, tungsten-plating method, its application as copper-based reinforcing phase and obtained diamond/copper composite material
  • A kind of tungsten-plated diamond particles, tungsten-plating method, its application as copper-based reinforcing phase and obtained diamond/copper composite material
  • A kind of tungsten-plated diamond particles, tungsten-plating method, its application as copper-based reinforcing phase and obtained diamond/copper composite material

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Effect test

Embodiment 1

[0039] Weigh 2 g of synthetic diamond powder (100-150 μm in particle size), first put the diamond particles into an acetone solution, and clean them with ultrasonic vibration for 0.5 h to remove hydrocarbons, then wash them with deionized water until neutral; then Place the diamond particles in a 10g / L NaOH solution, clean them with ultrasonic vibration for 0.5h, clean and remove oil, take them out and wash them with deionized water until neutral; then place the diamond particles in 10% HNO 3 In the process, ultrasonic vibration was used to clean for 0.5h, and the cleaning was roughened. After taking it out, it was washed with deionized water until it was neutral; finally, the diamond particles were placed in an oven to dry. Continuous magnetron sputtering coating equipment is used to evenly spread the cleaned and dried diamond particles on the heating platform and then put the platform on the conveyor belt. During the deposition process, the platform is kept vibrating, and the...

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Abstract

The invention discloses a tungsten-plated diamond particle, a tungsten-plating method, its application as a copper-based reinforcing phase and a diamond / copper composite material obtained, belonging to the field of composite materials. The tungsten plating method for diamond particles of the present invention uses ultrasonic vibration to keep the diamond particles in a vibrating state during the coating process, and at the same time controls the coating rate to achieve uniform coating on each surface of the particles. The tungsten-coated diamond particles obtained by the tungsten-plating method of the present invention have good bonding between the coating and the surface of the diamond particles and high density, which solves the problem that the coating is easy to fall off in the prior art, and can greatly reduce the interface thermal resistance between the diamond particles and the substrate.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to a tungsten-plated diamond particle, a tungsten-plating method, its application as a copper-based reinforcing phase, and the obtained diamond / copper composite material. Background technique [0002] With the development of integration and miniaturization of high-power devices, the power density of power devices is increasing day by day. Related reports show that the power density of high-power devices can reach 1010W / m 2 , its calorific value is increasing, and power devices often cannot work normally due to high temperature in application, which seriously affects their working stability, safety and reliability, and the requirements for heat dissipation performance are getting higher and higher. Heat dissipation has become a major technical bottleneck in the development of the electronic information industry. Traditional electronic packaging heat sink materials tungst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/02C23C14/18C23C14/35B22F1/02B22F3/105B22F3/26C22C1/10
CPCC23C14/02C23C14/185C23C14/35C23C14/223B22F3/105B22F3/26C22C1/1015C22C1/1036B22F2003/1051B22F1/17
Inventor 宋忠孝梁冰朱晓东钱旦李雁淮周子轩
Owner XI AN JIAOTONG UNIV
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