Laser device, laser device emission plate assembly, laser radar and laser device packaging method

A laser and emission board technology, applied in the field of lasers, can solve the problems of cumbersome and complicated processes, and achieve the effect of improving the ranging performance

Active Publication Date: 2019-11-15
HESAI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, within a certain size, the vertical angular resolution limit of lidar will be greatly restricted by the thickness of the circuit board and the height of components on the circuit board, etc.
[0007] Secondly, in order to ensure the consistency of the vertical angle of the laser radar, it is necessary to precisely fix the position of the circuit board carrying each laser, and the process is cumbersome and complicated

Method used

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  • Laser device, laser device emission plate assembly, laser radar and laser device packaging method
  • Laser device, laser device emission plate assembly, laser radar and laser device packaging method
  • Laser device, laser device emission plate assembly, laser radar and laser device packaging method

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Embodiment Construction

[0045] In the following, only some exemplary embodiments are briefly described. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature and not restrictive.

[0046] In describing the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Straight", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", etc. or The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orie...

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Abstract

The invention relates to a laser device. The laser device includes a substrate having a positioning portion, a laser device chip which is arranged on the substrate and has a light emitting surface, and a laser beam shaping element which achieves positioning through the positioning portion and is opposite to the light emitting surface of the laser device chip. The invention further relates to a laser device packaging method and a laser radar having the laser device. The laser device is advantaged in that the limit of the vertical direction angle resolution of a laser emitting board assembly (limited only by the fast axis size) can be greatly improved, a precise positioning structure is processed on a silicon base to effectively control the fast axis divergence angle after compression and beam directivity, and ranging performance is improved.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a laser, a laser emitting board assembly including the laser, a laser radar and a packaging method of the laser. Background technique [0002] LiDAR is a general term for laser active detection sensor equipment. Its working principle is roughly as follows: the transmitter of the laser radar emits a beam of laser light. After the laser beam encounters an object, it returns to the laser receiver after diffuse reflection. The distance between the transmitter and the object can be calculated by multiplying the time interval between sending and receiving signals by the speed of light and dividing by 2. According to the number of laser beams, there are usually single-line lidar, 4-line lidar, 8 / 16 / 32 / 64-line lidar, etc. One or more laser beams are emitted at different angles in the vertical direction and scanned in the horizontal direction to realize the detection of the three-dimensio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/00H01S5/40H01S5/022G01S17/88G01S7/491G01S7/484G01S7/481
CPCH01S5/005H01S5/4031G01S7/484G01S7/4911G01S7/4814G01S17/88
Inventor 李娜向少卿
Owner HESAI TECH CO LTD
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