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Lasers, laser launch board assemblies, lidar and laser packaging methods

A laser and emission board technology, applied in the field of lasers, can solve the problems of cumbersome and complicated processes, and achieve the effect of improving the ranging performance

Active Publication Date: 2021-05-11
HESAI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, within a certain size, the vertical angular resolution limit of lidar will be greatly restricted by the thickness of the circuit board and the height of components on the circuit board, etc.
[0007] Secondly, in order to ensure the consistency of the vertical angle of the laser radar, it is necessary to precisely fix the position of the circuit board carrying each laser, and the process is cumbersome and complicated

Method used

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  • Lasers, laser launch board assemblies, lidar and laser packaging methods
  • Lasers, laser launch board assemblies, lidar and laser packaging methods
  • Lasers, laser launch board assemblies, lidar and laser packaging methods

Examples

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Embodiment Construction

[0045]In the following, some exemplary embodiments are simply described. As will be appreciated by those skilled in the art, the described embodiments can be modified in a variety of different ways without departing from the spirit or scope of the invention. Thus, the drawings and description are considered to be essentially exemplary rather than limiting.

[0046]In the description of the present invention, it is necessary to understand that the term * # * center * # *, * # * portrait * # *, * # * horizontal * # *, * # * length * # *, * # * width * # *, * # * Thickness * # *, * # * * # *, * # * * # *, * # *, * # *, * # * left * # * , * # * * # *, * # * Horizontal * # *, * # * top * # *, * # * bottom * # *, * # * within * # *, * # * Outside * # *, * # * Clock-clockwise * # *, * # * The orientation or positional relationship of the indication of the indication * # * is based on the orientation or positional relationship shown in the drawing, just for easy description Invention and simpl...

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Abstract

The present invention relates to a laser, comprising: a substrate with a positioning portion; a laser chip disposed on the substrate, the laser chip having a light-emitting surface; and a laser beam shaping element positioned through the positioning portion, And it is opposite to the light-emitting surface of the laser chip. The invention also relates to a laser packaging method and a laser radar including the laser. Through the technical solution of the present invention, the limit of angular resolution in the vertical direction of the laser emitting board assembly (only limited by the size of the fast axis) can be greatly improved, and by processing a precise positioning structure on the silicon base, the compression after compression can be effectively controlled. The fast-axis divergence angle and beam directivity improve the ranging performance.

Description

Technical field[0001]The present invention relates to the field of laser light, and more particularly to a laser, including a laser emitting plate assembly, laser radar, and a package method of the laser.Background technique[0002]Laser radar Lidar is a collective as a laser active detecting sensor device. The working principle is roughly as follows: laser radar transmits a bundle laser, after the laser beam encounters an object, returned to the laser receiver, radar module The distance from the transmitter and the object can be calculated based on the time interval of the transmission and reception signals. According to the laser harness,, for example, a single laser radar, a 4-wire laser radar, 8 / 16 / 32 / 64 line laser radar, and the like. One or more laser beams are transmitted along different angles in the vertical direction, scanned horizontally, and realize the detection of three-dimensional profile of the target area. Multiple measurement channels (lines) are equivalent to a plur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/00H01S5/40H01S5/02315G01S17/88G01S7/4911G01S7/484G01S7/481
CPCH01S5/005H01S5/4031G01S7/484G01S7/4911G01S7/4814G01S17/88
Inventor 李娜向少卿
Owner HESAI TECH CO LTD