A method for detecting the reliability of photovoltaic modules

Abstract

The invention discloses a method for detecting the reliability of a photovoltaic module, which includes the following steps: S1, removing the secondary tube of the module, and arranging a thermocouple on the back plate; 1.5-2.5 times the reverse current of the short-circuit current, so as to generate the temperature required for the test, keep it for more than 10 minutes, and record the power supply current value and voltage value; S3, switch the circuit to constant voltage mode, and keep the voltage value in step S2 The recorded voltage value remains stable for 10 minutes; S4, load the positive 2400PA dynamic mechanical load on the component, and maintain it for not less than 24 hours, and continuously record the power supply current value during the period; The load test is qualified, otherwise it is not qualified. The present invention adopts the method of adding high-temperature mechanical load to cause mechanical deformation of the new process components at high temperature, so as to verify the long-term reliability of the outdoor use of the components, which is very worthy of promotion.

Description

technical field [0001] The invention relates to the technical field of crystalline silicon photovoltaic modules for ground use, in particular to a reliability detection method for photovoltaic modules. Background technique [0002] With the development of photovoltaic module technology and the wider application of new products, new cell interconnection processes (such as shingling, splicing, etc.) are constantly emerging, and new cell interconnection materials (such as conductive glue, solder paste, flexible ribbon, etc.). [0003] These newly added materials play a vital role in the internal interconnection of components and current transmission. These materials also have some characteristics of their own, such as the low melting point of solder paste, and the reduced bonding performance of conductive adhesives at high temperatures. There are also some extreme conditions in the outdoor application conditions of photovoltaic modules, at which time these characteristics of t...

AI Technical Summary

Problems solved by technology

[0006] 2. Due to outdoor weather and other reasons, the components will bear certain mechanical deformation, especially in plain windy areas;

[0007] 3. At present, the conductivity and bonding performance of silicone and acrylic conductive adhesives that are widely used in the market will be reduced when they are exposed to high temperature (between 120°C and 140°C) for a long time (heated to 120°C, very Easy to disassemble shingled battery string)

[0008] 4. The melting point of low-temperature solder is about 130°C, and there is a lack of corresponding detection whether the molten solder can play an effective conductive interconnection role at the component end;

[0009] 5. Heterojunction batteries are mostly welded with low-temperature ribbons, and the welding tension is low. Whether this weak welding can ensure the long-term reliability of the components also requires corresponding detection methods

New process components are still tested according to the original reliable new detection method, which is not conducive to the guarantee of long-term reliability of components

[0012] (2) The detection of mechanical deformation is included in the international standard, such as the mechanical load test of IEC61215-10-16, but it is not carried out at high temperature. New processes such as conductive adhesive and solder paste have good conductive interconnection performance at room temperature Yes, so the test results are not convincing

[0013] (3) High temperature testing is included in international standards, such as the hot spot durability test of IEC61215-10-9, but there is no external force to deform the components in this test, and it is impossible to simulate outdoor use, while the thermal cycle of IEC61215-10-11 In the experiment, the highest temperature in the IEC61215-10-13 damp heat test is 85°C, which is not enough to reduce the adhesive force of the conductive adhesive, without external force deformation, and the test period is long

[0014] Therefore, the current existing reliability verification lacks a method that can detect the long-term reliability of components that undergo mechanical deformation at high temperatures

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