A positioning and pressing method for making mixed pressing boards

Abstract

The invention discloses a positioning and stitching method for producing mixed pressing plates in the technical field of manufacturing methods. The method comprises the following steps: step 1: material confirmation: performing material selection, wherein the material is an FR4 material plate, a main high-frequency material plate, an auxiliary high-frequency material plate, a main prepreg and an auxiliary prepreg, and after final requirements provided by a customer are provided,professional engineers perform detailed sorting on the requirements. According to the positioning and stitching method for producing the mixed pressing plates, grooves and multiple groups of barriers are formed in the surrounding of the bottom of an inner cavity of a heater in cooperation with a mould, a force can be applied after the high-frequency material plates are built in, semi-cured liquid that overflows the barriers is scrapped while heating, so that the removal of the excessive semi-cured liquid can beensured while the heating curing speed is effectively improved, secondary treatment is avoided, in cooperation with a reverse built-in secondary stitching process, the pressures on the two layers of high-frequency material plates are similar, the combination thicknesses are close, the both ends are heated, the stability is good, and the crimping resistance is high.

Description

technical field [0001] The invention discloses a positioning pressing method for making a mixed pressing board, and specifically belongs to the technical field of manufacturing methods. Background technique [0002] The rapid development of electronic communication technology is an inevitable process of modernization. In order to achieve high-speed and high-fidelity transmission of signals, more and more high-frequency printed circuit boards are used in communication equipment; the dielectric materials used in high-frequency boards have excellent Electrical properties, good chemical stability, high-frequency boards are widely used in wireless antennas, base station receiving antennas, power amplifiers, components (shunts, combiners, filters), radar systems, navigation systems and other communication equipment. [0003] Multi-layer high-frequency board design, based on factors such as cost savings, improved bending strength, and electromagnetic interference control, often app...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a positioning and pressing method for the production of mixed pressure boards, to solve the existing process of combining the mixed pressure boards proposed in the above-mentioned background technology, because there are material differences between the FR4 material board and the high-frequency material board. The difference is that if there is an excessive amount of semi-cured liquid used in the combination process, and the combined curing speed cannot be effectively improved, it is very easy to cause concave and convex surfaces in the bonding process of the FR4 material board and the high-frequency material board. As a result, the stability performance is reduced, and the curling situation often occurs. At the same time, the conventional pressing process cannot ensure that the pressure of the material plates is similar, and the combined thickness is affected, which further reduces the stability of the use.