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A method for hybrid integration of heterogeneous materials with different sizes

A hybrid integration, heterogeneous material technology, used in electrical components, circuits, semiconductor/solid-state device manufacturing, etc., can solve problems such as difficult to achieve bonding interface holes and bonding accuracy

Active Publication Date: 2021-05-14
长春长光圆辰微电子技术有限公司
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is: due to the difference in size between 2-inch wafers and 8-inch wafers, existing machines cannot be used to complete direct bonding. Although manual bonding methods can be used, it is difficult to achieve bond alignment by manual methods. The problem of the control of bonding interface holes and bonding accuracy provides a method of mixing and integrating heterogeneous materials of different sizes for the bonding of 2-inch wafers and 8-inch wafers

Method used

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  • A method for hybrid integration of heterogeneous materials with different sizes
  • A method for hybrid integration of heterogeneous materials with different sizes
  • A method for hybrid integration of heterogeneous materials with different sizes

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Embodiment Construction

[0026] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. It should be understood by those skilled in the art. What is specifically described below is illustrative rather than restrictive. In order not to obscure the essence of the present invention, well-known methods and procedures have not been described in detail.

[0027] The present invention aims to complete the bonding of 2-inch wafers and 8-inch wafers by using molds, such as figure 1 ,figure 2, image 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, a method for mixing and integrating heterogeneous materials of different sizes includes the following steps, and the following steps are performed in sequence:

[0028] Step 1. Take a 2-inch wafer 2 and install it in the cutting hole opened in the middle of the mold 1. The material used in the mold 1 is ceramics. Take an 8-...

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Abstract

The invention discloses a method for mixing and integrating heterogeneous materials of different sizes, which belongs to the field of semiconductor manufacturing. The method uses a mold to complete the bonding of a 2-inch wafer and an 8-inch wafer, and at the same time utilizes mechanical alignment and optical alignment The method is combined to complete two bonding processes, and an 8-inch production machine is used for photolithography and other processes between the bonding processes to realize the mixed integration of heterogeneous materials of different sizes and ensure alignment accuracy.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, and in particular relates to a method for mixing and integrating heterogeneous materials of different sizes. Background technique [0002] In recent years, the introduction of wafer direct bonding technology has provided new ideas for semiconductor manufacturing. In Micro-Electro-Mechanical Systems (MEMS), Back-side illumination CMOS image sensor, BSI-CIS) and other fields have a wide range of applications. [0003] The bandgap width of silicon is 1.12ev, and the corresponding spectral range is 300μm-1200μm. In the field of photoelectric detection and imaging, it is often necessary to analyze a wider range of optical signals. Combining the photoelectric response characteristics of different materials to manufacture optoelectronic devices has become a a new way. For example, the band gap of germanium is 0.46ev lower than that of silicon, and the hole mobility of germanium is 4 times th...

Claims

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Application Information

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IPC IPC(8): H01L21/18
CPCH01L21/187
Inventor 程禹李彦庆赵东旭陈艳明方小磊刘佳
Owner 长春长光圆辰微电子技术有限公司
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