Anti-sticking material

A technology of anti-adhesive materials and anti-adhesive coatings, which is applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of low friction coefficient and low total surface energy of anti-adhesive coatings

Active Publication Date: 2019-12-03
CITY UNIVERSITY OF HONG KONG
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0006] Another object of this specification is to provide an anti-stick coating, which has a lower total surface energy and a lower co...

Method used

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Embodiment 1

[0047] The present embodiment provides a kind of preparation method of anti-sticking coating, it comprises the following steps:

[0048] (1) Optimizing the sputtering system and vacuum system in the plasma-enhanced magnetron sputtering equipment: the equipment uses multiple magnetron targets and linear gas ion sources, and the magnetic force lines are connected between the magnetron targets to form a closed magnetic field to ensure The deposition substrate is in a high-density plasma region. Closed magnetic coupling results in high ionization and bias current densities. A pair of Cr targets and one Mo target and one Ni target were used for deposition. Each target was driven by a pulsed power supply at a frequency of 50-100 kHz, while the substrate holder was biased by a pulsed DC bias at a frequency of 250 kHz.

[0049] (2) Upgrade and improve the sputtering system, using a linear gas ion source (Hall type) to provide reactive gases Ar and N 2 , the linear gas ion source ca...

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PUM

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Abstract

The present specification provides an anti-sticking material. The anti-sticking material comprises at least one hard phase material and at least one soft phase metal, and the atomic percentage contentof the soft phase metal is 10% or above. The anti-sticking material is prepared by a physical vapor deposition method and has the relatively stronger anti-sticking performance. A hard anti-sticking coating prepared from the anti-sticking material has the relatively lower total surface energy and a relatively lower friction coefficient, and the sticking problem between the plastics, such as an epoxy molding compound (EMC-Epoxy Molding Compound), etc., and an injection mold, can be effectively solved.

Description

technical field [0001] This specification belongs to the field of coating materials and relates to an anti-adhesive material. Background technique [0002] In the modern world, technological changes and developments in end-user markets such as telecommunications, automotive, consumer electronics, networking and computing are the main drivers of increasing demand. Future developments in silicon devices may require better electronic packaging in terms of performance, quality, and reliability. According to industry-leading analysts, the annual sales growth rate of semiconductor devices is in the range of 8-11%. For the semiconductor assembly and packaging equipment industry, the annual growth rate is about 13-19%. Although IC shipments declined in 2008-2009, this was only a temporary decline in the development process. Numbers have started to rise again in recent years. IC growth is expected to be 22% in 2017. The semiconductor packaging and assembly market will witness su...

Claims

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Application Information

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IPC IPC(8): C23C14/06C23C14/16C23C14/35C23C14/58C23C14/54
CPCC23C14/0688C23C14/165C23C14/0641C23C14/352C23C14/3485C23C14/345C23C14/0042C23C14/548C23C14/5806
Inventor 李国恩周志烽
Owner CITY UNIVERSITY OF HONG KONG
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