Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Hot-melt pressure sensitive adhesive composition having improved rheological properties

An adhesive and composition technology, applied in the field of bonding substrates and hot-melt pressure-sensitive adhesives, can solve the loss of structural integrity of adhesives, reduction of adhesive bonding toughness, and adhesive bonding. Failure and other problems, to achieve the effect of high bond strength, good high temperature heat resistance, low odor

Active Publication Date: 2019-12-06
SIKA TECH AG
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

at below T g temperature, the adhesive material becomes brittle and the toughness of the adhesive bond decreases
At temperatures above the intersection point, the adhesive loses its structural integrity, which can eventually lead to adhesive bond failure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Hot-melt pressure sensitive adhesive composition having improved rheological properties
  • Hot-melt pressure sensitive adhesive composition having improved rheological properties

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0084] The compounds and products shown below in Table 1 were used in the examples.

[0085] Table 1

[0086]

[0087] Preparation of Adhesive Composition

[0088] For each adhesive composition, the ingredients shown in Table 1 were mixed in a Sigma kneader at a temperature of 180°C. The preparation process begins by mixing the styrenic block copolymer, a small portion of the resin and additives. The first mixing step was in CO 2 - Under atmosphere and for 45 minutes, then add the rest of the resin and continue mixing under vacuum for 30 minutes.

[0089] The liquid polyisobutylene was then added to the mixture and mixing was continued for an additional 30 minutes under vacuum. The adhesive compositions were stored in siliconized boxes for one day before being used to characterize their properties.

[0090] Viscosity at 190°C

[0091] Viscosity was measured using a Brookfield DV-2 Thermosel viscometer with a No. 27 spindle at a temperature of 190°C at 10 revolution...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
softening pointaaaaaaaaaa
softening pointaaaaaaaaaa
softening pointaaaaaaaaaa
Login to View More

Abstract

The invention is directed to adhesive compositions containing at least one first styrene-isoprene-styrene block copolymer having a diblock content of not less than 45 %, at least one second styrene-isoprene- styrene block copolymer having a styrene content of not more than 30 wt.-%, at least one first tackifying resin having a softening point of equal to or higher than 100 DEG C, and at least onesecond tackifying resin having a softening point of equal to or higher than 120 DEG C. The invention is also directed to a method for bonding substrates together using the adhesive composition.

Description

technical field [0001] The present invention relates to an adhesive composition, especially a hot-melt pressure-sensitive adhesive and its use for bonding substrates. [0002] Background of the invention [0003] Hot melt adhesives are one-component, water- and solvent-free adhesives that are solid at room temperature. These adhesives are applied in the form of a melt, and the adhesive bond is established by cooling and setting. Due to the relatively short open times, the substrates to be bonded are often assembled immediately or after a few minutes after application of the adhesive melt. In some applications, the waiting time, i.e. the period of time between applying the adhesive to the surface of the first substrate and bringing the adhesive film into contact with the second substrate, is relatively long and the bond must be made hot. The agent layer is reactivated. Typically, the adhesive-coated first substrate is cooled and stored for a more or less extended period of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/02C09J7/35C09J7/38C09J123/00C09J123/26C09J5/00
CPCC09J123/26C09J153/02C08L2205/025C08L2205/035C08L101/00C08L23/26C08L23/20C08L23/02C08L53/02C08L25/00C09J7/387C08F240/00C09J2203/00
Inventor D·尤丁J·R·维拉费雷拉T·汉霍斯特
Owner SIKA TECH AG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com